Sapphire ingot can be offered by PAM-XIAMEN, one of sapphire ingot manufacturers. The chemical composition is alumina and is composed of three oxygen atoms and two aluminum atoms covalently bonded together. Sapphire crystal structure is a hexagonal lattice structure, and the commonly used section [...]
2021-09-10meta-author
We are an expert of semiconductor wafers in semiconductor industry, and we offer technology support and wafers selling for thousands of univerisities and industrial customers by our decades experience, including Cornell University, Stanford Univeristy,Peking University, Shandong Univerity, university of south carolina,Caltech Faraon lab (USA),University of California, Irvine (USA),Singapore MIT Alliance for Research and Technology Centre (SMART),West Virginia University,Purdue Univerity, University of California, Los Angeles,King Abdullah University of Science & Technology,Massachusetts Institute of Technology,University of Houston,University of Wisconsin,University of Science and Technology of China etc.
And now we show one article example as follows, who bought our wafers or service:
Article title:Multisite microLED optrode array for neural interfacing
Published by:
Niall McAlinden; Yunzhou Cheng; Robert Scharf; Enyuan Xie; Erdan Gu; Christopher F. Reiche; [...]
2019-12-09meta-author
Diamond wafers from PAM-XIAMEN are wafer-scale products that are used to tap the huge potential of diamond materials, such as tribological testing, unique nano-scale processing applications and MEMS development. In the current diamond wafer market, there are three grade diamond wafer, Microelectronics Grade diamond wafer, Thermal [...]
2018-07-10meta-author
Today, among the existing semiconductor materials, diamond is one of the most promising semiconductor materials. Usually, it is used as diamond thermal management material. The article will mainly discuss the diamond from 3 parts: what is diamond, diamond material properties and its applications.
1. What Is Diamond?
Diamond [...]
2021-04-30meta-author
Below is the regular standard specification of Polycrystalline back sealed polished wafer, please kindly note in this size, normally notch is used, rather than flat.
Si Wafer with back seal poly+SiO2
1. Polycrystalline Back Sealed Silicon Wafer Specification
Parameter
Unit
PAM210305-SI
Grade
—
Polycrystalline back sealed polished wafer
General Characteristics
—
—
Growth Method
—
CZ
Diameter
mm
200±0.2
Type
—
N
Crystal Orientation
—
<100>±0.5
Dopant
—
AS
Electrical Characteristics
—
—
Resistivity
Ω•cm
0.002-0.004
RRG [...]
2021-03-25meta-author
PAM XIAMEN offers 4″FZ Prime Silicon Wafer.
4″ Si wafer, R>20,000Ωcm
Silicon, Si wafers
orientation (100)
dimensions 100 mm x 525µm (+/-25µm) thick.
FZ >20 000 ohm.cm
Ra<0.5 nm
One side polished
Ra<0.5nm (µelectronic grade)
For more information, please visit our website: https://www.powerwaywafer.com,
send [...]
2019-07-05meta-author