Sic Chips

Sic Chips

PAM-XIAMEN offer SiC substrate with Ag, Ti or Ni or Au metal layers with small chips:

1.PAM200508-SIC-AU
10×10mm SiC substrate / Ti(0.1um)-Ni(0.1um)-Au(2um), n type.
Grade: dummy
Thickness: approx. 350um
Backside surface: with metal films of Ti-Ni-Au
Metal thickness: Ti(0.1um)-Ni(0.1um)-Au(2um),
2. SiC Wafer with thermal oxide and LPCVD nitride or Silicon Carbide Wafer with the sputtering Cr/Au Layer, such as SiC wafer with 1um SiO2 by PECVD
3.SiC Wafer with Ti coating on backside, thickness:100nm

 

 

Sic Chips

 

 

 

 

 

 

 

 

 

 

 

 

For more information, please contact us email at victorchan@powerwaywafer.com and powerwaymaterial@gmail.com

2020-07-17

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