SiC Substrate and Epitaxy:
SiC wafer is the third generation wide bandgap semiconductor material with excellent performance. It has the advantages of wide bandgap, high thermal conductivity, high breakdown electric field, high intrinsic temperature, radiation resistance, good chemical stability and high electron saturation drift rate. SiC wafer has also great application prospects in aerospace, rail transit, photovoltaic power generation, power transmission, new energy vehicles and other fields, and will bring revolutionary changes to power electronics technology.
SiC substate(epi ready), N type and Semi-insulating,polytype 4H and 6H in different quality grades, Micropipe Density (MPD):Free, <5/cm2, <10/cm2, <30/cm2,<100/cm2
SiC Epitaxy:Wafer to wafer thickness uniformity: 2% ,Wafer to wafer doping uniformity: 4%