PAM XIAMEN offers Silicon Carbide (SiC) Wafers and Crystals.
PAM XIAMEN offers the best prices on the market for high-quality silicon carbide wafers and substrates up to six (6) inch diameter with both N type and Semi-insulating types. Our SiC wafers have been widely used by small and large semiconductor device companies as well as research labs worldwide. Browse silicon carbide substrates below.
APPLICATIONS OF SIC CRYSTAL SUBSTRATES AND WAFERS
Silicon carbide (SiC) crystals have unique physical and electronic properties. Silicon Carbide based devices have been used for short wavelength opto-electronic, high temperature, radiation resistant applications. The high-power and high-frequency electronic devices made with SiC are superior to Si and GaAs based devices. Below are some popular applications of SiC substrates.
III-V Nitride Deposition
GaN, AlxGa1-xN and InyGa1-yN epitaxial layers on SiC substrate or sapphire substrate. Gallium Nitride Epitaxy on SiC Templates are used to fabricate blue light emitting diodes (blue LED) and and nearly solar blind UV photo detectors
SiC based devices have low lattice mismatch with III-nitride epitaxial layers. They have high thermal conductivity and can be used for the monitoring of combustion processes and for all sorts of UV-detection. SiC-based semiconductor devices can work under very hostile environments, such as high temperature, high power, and high radiation conditions.
High Power Devices
SiC has the following properties:
Wide Energy Bandgap
High electrical breakdown field
High saturation drift velocity
High thermal conductivity
SiC is used for the fabrication of very high-voltage and high-power devices such as diodes, power transistors, and high power microwave devices. Compared to conventional Si-devices, SiC-based power devices have faster switching speed higher voltages, lower parasitic resistances, smaller size, less cooling required due to high-temperature capability.
SiC has higher thermal conductivity than GaAs or Si meaning that SiC devices can theoretically operate at higher power densities than either GaAs or Si. Higher thermal conductivity combined with wide band gap and high critical field give SiC semiconductors an advantage when high power is a key desirable device feature.
Currently silicon carbide (SiC) is widely used for high power MMIC applications. SiC is also used as a substrate for epitaxial growth of GaN for even higher power MMIC devices
High Temperature Devices
Because SiC has a high thermal conductivity, SiC dissipates heat more rapidly than other semiconductor materials. This enables SiC devices to be operated at extremely high power levels and still dissipate the large amounts of excess heat generated from the devices.
High Frequency Power Devices
SiC-based microwave electronics are used for wireless communications and radar
Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China. PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices. PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.
With more than 25+years experiences in compound semiconductor material field and export business, our team can assure you that we can understand your requirements and deal with your project professionally.