Silicon Ingots-4

Silicon Ingots-4

PAM XIAMEN offers Silicon Ingots.

Material Description
FZ 2″Ø×38mm ingot, p-type Si:B[100]±2º, Ro:~2,900Ohmcm
FZ 2″Ø×(392+342+304+263+250+175)mm ingots, p-type Si:B[111]±2º, (2,000-5,000)Ohmcm
FZ 2″Ø×(100+87+86+85+85+84)mm ingots, n-type Si:P[111], (2,000-4,000) {2,166-3,835} Ohmcm
FZ 2″Ø×26mm ground ingot, n-type Si:P[111]±2º, (5,000-13,000)Ohmcm, MCC Lifetime>1,100μs
FZ 2″Ø ingot Intrinsic Si:-[100], Ro: >20,000 Ohmcm, Ground, (6 ingots: 154mm, 117mm, 143mm, 100mm, 101mm, 100mm)
FZ 2″Ø×(160+98)mm ingots, Intrinsic Si:-[111]±2º, Ro>12,000 Ohmcm
FZ 2″Ø ingot Intrinsic Si:-[111] ±0.5°, Ro: >20,000 Ohmcm, Ground
FZ 1″Ø ingot p-type Si:B[100] ±2°, Ro:1-3 Ohmcm, (5 ingots: 76mm, 80mm, 80mm, 82mm, 82mm) , Lifetime=300µs
FZ p-type Si:B[100] ±2°, Ro:1-3Ohmcm, (1 ingot: 81mm total, of which 21mm is usable), Improperly cored
FZ 1″Ø ingot p-type Si:B[100], Ro: 2,652-2,743 Ohmcm, 7 pieces, each 0.17Kg
FZ 1″Ø ingot p-type Si:B[100] ±2.0°, Ro: 2,879-3,258 Ohmcm, (1 ingot: 31mm, 0.05Kg, $200 for the piece)
FZ 1″Ø ingot p-type Si:B[100] ±2°, Ro:3,400-4,100Ohmcm, Ground, (3 ingots: 75mm, 76mm, 77mm) SEMI
FZ 1″Ø(37+37+38+38)mm ground ingot, n-type Si:P[100]±2°, Ro: ~2.7 Ohmcm, MCC Lifetime>7,000μs
FZ Silicon Ingot, 48mmØx217mm, n-type Si:P[111], Ro=~300 Ohmcm, (p-type Ro>3,000 Ohmcm)
FZ 1Ø×60mm ground ingot, n-type Si:P[111] ±2°, (1-2)Ohmcm
FZ 1″Ø ingot Intrinsic Si:-[111] ±2.0°, Ro: >17,500 Ohmcm, (2 ingots: 34.5mm, 29mm, $500 for each piece)
FZ 6.35mmØ ingot Intrinsic Si:-[111], Ro: >10,000 Ohmcm, (1 lot of 11 rods, each ranging from 15mm to 49mm long)
FZ 6.35mmØ ingot Intrinsic Si:-[111], Ro: >10,000 Ohmcm, (1 lot of 8 rods, each 51mm long)
FZ 0.5″Ø×110mm ingot, n-type Si:P[100], Ro: 5,497-10,293 Ohmcm, MCC Lifetime>6,500µs
FZ SCRAP material p-type, Ro: 1,000-10,000 Ohmcm
FZ SCRAP material p-type, Ro: 1-1,000 Ohmcm

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Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China.PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices.PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.

Our goal is to meet all of your requirements, no matter how small orders and how difficult questions they may be,
to maintain sustained and profitable growth for every customer through our qualified products and satisfying service.

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