Compound Semiconductor Wafer Including Gaas Wafer,Germanium Wafer, InP Wafer,InSb Wafer
In Stock, But Not Limited To The Following.
Wafer No.
Wafer Size
Polished
Type
Wafer Thickness
Quantity(pcs)
Dislocation Density
Resistivity(ohm.cm)
PAM-XIAMEN-WAFER-#III-V1
1″
SSP
N100
450±25
9
EPD<700
0.00204-0.00427
PAM-XIAMEN-WAFER-#III-V2
10*11 cell
average efficiency 32.72%
—
—
56
—
—
PAM-XIAMEN-WAFER-#III-V3
2″
SSP
Semi-insulating
350um
10
EPD<700
—
PAM-XIAMEN-WAFER-#III-V4
2″
DSP
Semi-insulating
350±20
2
EPD<900
—
PAM-XIAMEN-WAFER-#III-V5
2″
DSP
Semi-insulating
350±20
2
EPD<600
—
PAM-XIAMEN-WAFER-#III-V6
2″
SSP
N type 15°
350um
1
EPD<5000
—
PAM-XIAMEN-WAFER-#III-V7
2″
SSP
N type 15°
350um
35
EPD500-1000
—
PAM-XIAMEN-WAFER-#III-V8
2″
DSP
N type 2°
350um
5
<50
—
PAM-XIAMEN-WAFER-#III-V9
2″
SSP
N type 2°
350um
2
EPD1735-2198
—
PAM-XIAMEN-WAFER-#III-V10
2″
SSP
N type 2°
350um
25
EPD1569-2061
—
PAM-XIAMEN-WAFER-#III-V11
2″
SSP
N type 2°
450um
3
—
PAM-XIAMEN-WAFER-#III-V12
2″
DSP
N type
400±15
14
EPD<50
—
PAM-XIAMEN-WAFER-#III-V13
2″
DSP
N type
625±15
4
epd1300-1400
—
PAM-XIAMEN-WAFER-#III-V14
2″
DSP
N type
625±15
34
EPD50-100
—
PAM-XIAMEN-WAFER-#III-V15
2″
DSP
N type 100
110um
15
JGS2001002,G202001X
—
PAM-XIAMEN-WAFER-#III-V16
2″
SSP
PNP/N Epi wafer
—
4
—
—
PAM-XIAMEN-WAFER-#III-V17
2″GaP
SSP
—
250±20
1
—
—
PAM-XIAMEN-WAFER-#III-V18
3″
SSP
Semi-insulating
600um/625um
1
—
—
PAM-XIAMEN-WAFER-#III-V19
3″
DSP
Semi-insulating
586um
1
—
—
PAM-XIAMEN-WAFER-#III-V20
3″
DSP
Semi-insulating
600um/501um
1
—
—
PAM-XIAMEN-WAFER-#III-V21
3″
SSP/DSP
Semi-insulating
625um
25
—
—
PAM-XIAMEN-WAFER-#III-V22
3″
DSP
625±20
20
—
—
PAM-XIAMEN-WAFER-#III-V23
3″
DSP
Semi-insulating
3500±20
2
—
—
PAM-XIAMEN-WAFER-#III-V24
3″
DSP
Semi-insulating
625um
35
—
—
PAM-XIAMEN-WAFER-#III-V25
3″
SSP/DSP
N type [...]
2019-11-27meta-author
Superconductor Substrates
Crystal
Structure
M.P.
Density
Thermal Expansion
Dielectric constant
Growth Tech. & max. size
standard 1or 2 sides epi polished wafer
oC
g/ cm3
LSAT
Cubic
1840
6.74
10
22
CZ
20x20x0.5mm
(LaAlO3)0.3 -(Sr2AlTaO8)0.7
a=3.868 Å
Ø35mm
10x10x0.5mm
LaAlO3
Rhombo.
2100
6.51
9.2
24.5
CZ
Ø3″x0.5mm
a=3.790 Å
Ø3″
Ø2″x0.5mm
c=13.11 Å
Ø1″x0.5mm
10x10x0.5mm
MgO
Cubic
2852
3.58
12.8
9.8
Flux
Ø2″x0.5mm
a=4.21 Å
Ø2″
10x10x0.5mm
NdGaO3
Orthor.
1600
7.57
7.8
25
CZ
Ø2″x0.5mm
a=5.43 Å
Ø2″
10x10x0.5mm
b=5.50 Å
c=7.71 Å
SrTiO3
Cubic
2080
5.12
10.4
300
vernuil
10x10x0.5mm
a=3.90 Å
Ø30mm
SrLaAlO4
Tetrag.
1650
16.8
CZ
10x10x0.5mm
a=3.756 Å
Ø20mm
c=12.63 Å
YAlO3
Orthor.
1870
4.88
2 ~ 10
16`20
CZ
10x10x0.5mm
a=5.176 Å b=5.307 Å
Ø30mm
c=7.355 Å
YSZ
Cubic
~2500
5.8
10.3
27
Flux
Ø2″x0.5mm
a=5.125 Å
Ø2″
10x10x0.5m
2018-07-10meta-author
Epi/Thin Film on Substrate
GaN Substrate/Template
SiO2+Si3N4 on Silicon wafer Substrate
GaAs/AlGaAs on GaAs (Si) Substrate
SiC 4H Film on 4H-SiC Substrate
AlN Thin Film Substrate
Aluminum Film Substrate
Silicon Nitride on Corning 7980 Substrate
La0.7Sr0.3MnO3 + PbZr(x)Ti(1-x)O3 on Nb(SrTiO3) substrate
Diamond on Silicon Wafer Substrate
Ag Conductive Film(Planarized silver nanowir)substrate
FTO Film on Substrates
Silicon Nitride [...]
2018-07-10meta-author
Lithium Niobate(LN) Thin Film on Insulator
Single crystal Lithium Niobate(LN) films can be integrated on lithium niobate substrate. The structure can be used in electro-optic modulators, optical waveguides, resonators, SAW devices, FRAM memory devices, etc.
Single crystal lithium niobate thin films are of great significance for the development of [...]
2018-08-22meta-author
Free-standing Gallium Nitride
Item No.
Type
Orientation
Thickness
Grade
Micro Defect Density
Surface
Usable area
N-Type
PAM-FS-GaN50-N
2″ N type
0°±0.5°
300±25um
A/B
0/<2/cm2
P/P or P/L
>90%
PAM-FS-GaN45-N
dia.45mm,N type
0°±0.5°
300±25um
A/B
0/<2/cm2
P/P or P/L
>90%
PAM-FS-GaN40-N
dia.40mm,N type
0°±0.5°
300±25um
A/B
0/<2/cm2
P/P or P/L
>90%
PAM-FS-GaN38-N
dia.38mm,N type
0°±0.5°
300±25um
A/B
0/<2/cm2
P/P or P/L
>90%
PAM-FS-GaN25-N
dia.25.4mm,N type
0°±0.5°
300±25um
A/B
0/<2/cm2
P/P or P/L
>90%
PAM-FS-GaN15-N
14mm*15mm,N type
0°±0.5°
300±25um
A/B
0/<2/cm2
P/P or P/L
>90%
PAM-FS-GaN10-N
10mm*10.5mm,N type
0°±0.5°
300±25um
A/B
0/<2/cm2
P/P or P/L
>90%
PAM-FS-GaN5-N
5mm*5.5mm, N type
0°±0.5°
300±25um
A/B
0/<2/cm2
P/P or P/L
>90%
SEMI-INSULATING
PAM-FS-GaN50-SI
2″ N type
0°±0.5°
300±25um
A/B
0/<2/cm2
P/P or P/L
>90%
PAM-FS-GaN45-SI
dia.45mm,N type
0°±0.5°
300±25um
A/B
0/<2/cm2
P/P or P/L
>90%
PAM-FS-GaN40-SI
dia.40mm,N type
0°±0.5°
300±25um
A/B
0/<2/cm2
P/P or P/L
>90%
PAM-FS-GaN38-SI
dia.38mm,N [...]
Ultra Flat Wafer Ultra Thin Wafer
We improve wafer thickness uniformity (TTV) through wafer thinning services and chemical mechanical polishing (CMP) services, which transfer wafers (such as LN, LT, silicon and quartz) to ultra-flat or ultra-thin wafers. We can produce ultra-flat silicon wafers, ultra-flat quartz wafers, ultra-thin LN wafers, ultra-thin [...]
2018-08-22meta-author