PAM XIAMEN offers Silver(Ag) on Si wafer .
Silver Film on Silicom Wafer ,Ag: 0.2 microns / ,Si(100) P-type R:1-20 ohm.cm
Silver Metallic Film
Film Deposition by DC Sputtering
Silver Thickness: 0.2 microns
Film Resistivity: N/A
Film Crystallinity: N/A
Roughness, RMS: 4.87 nm and < 10 nm
Silicon Wafer Specifications:
Conductive type: Si P- type,B-doped
Size: 4″ diameter +/- 0.5 mm x 0.525 +/- 0.025 mm th
Orientation: (100) +/- 0.5o
Polish: One sides polished
Surface roughness: Prime
Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China. PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices. PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.
With more than 25+years experiences in compound semiconductor material field and export business, our team can assure you that we can understand your requirements and deal with your project professionally.