PAM XIAMEN offers 3″ Si wafer Thickness: 380±20μm.
3″ Si wafer with Thermal Oxide of thickness 1000A
Diameter: 3″
Diameter: 76.2±0.3mm
Thickness: 380±20μm
Orientation: <100>±1°
Type/dopant: N type/Phosphorus
Resistivity: 1-20Ωcm
Polishing: SSP
Primary Flat 22.5±2.5mm, (110)±1°
Surface roughness: <5A
For more information, please visit [...]
2019-08-22meta-author
PAM XIAMEN offers TiO2(Rutile) substrates.
Rutile ( TiO2) single crystal is one of the most suitable materials used for spectral prisms and polarizing devices such as optical isolators and beam displacers because it has a large birefringence with a high refractive index. Compared to [...]
2019-05-20meta-author
980 Single Mode Laser Chip (PAM200827-LD)
PAM XIAMEN offers 980 Single Mode Laser Chip
Powerwaywafer
980 Single mode laser chip property
Minimum
Typical
Maximum
Central Wavelength 969 974 979 nm
970
980
990
Output Power (mW)
300
400
500
Working Mode CW
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—
—
Longitudinal mode Single
—
—
—
Spectrum Width
—
—
—
Emitter Width
—
—
—
Cavity Width (μm)
640
650
660
Cavity Length (μm)
4490
4500
4510
Cavity Thickness (μm)
115
125
135
Fast Axis Divergence(FWHM) 30 Deg
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Slow Axis Divergence (FWHM) [...]
2020-09-16meta-author
PAM XIAMEN offers 6″ FZ Silicon Wafer with Diameter 150mm, Both Side Etched
Silicon wafers, per SEMI Prime, E/E
6″ (150.0±0.2mm)Ø×400±25µm,
FZ n-type Si:P[100]±0.5°,
Ro=(1-5)Ohmcm,
Carbon<2E16 /cm³, Oxygen<2E16 /cm³,
TTV<12µm, Bow<40µm, Warp<50µm,
Bothsidesetched, One SEMI Flat (57.5mm),
Sealed in Empak or equivalent cassette,
MCC Lifetime>1000µs.
For more information, send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com
2020-06-10meta-author
As an important part of new materials, semiconductor materials are the top priority of all countries in the world for the development of electronic information industry. It supports the development of localization of electronic information industry and is of great significance to industrial structure [...]
2019-04-02meta-author
PAM XIAMEN offers 2″ Monocrystalline Silicon Wafer with Thermal Oxide 20nm
2inch diameter wafer made of monocrystalline silicon with isolation oxide
Diameter 50.8mm
Polishing: one-sided for microelectronics
Type of conductivity and alloying: not specified
Surface orientation: not specified
Primary and secondary flat orientation: not specified
Thickness: 675 microns±20 microns
Wedge (TTV): less than 15 microns
TTV<15μm
Distortion: less than 35 microns (the value is unchanged)
Thickness of the isolation oxide: at least 20 nm
Front side: polished
Back side: lapped-etched
For more information, send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com
2021-03-17meta-author