Super Low Stress Nitron on Silicon Wafers
PAM XIAMEN offers Super Low Stress Nitron on Silicon Wafers
When you need the thickest nitride Super Low Stress Nitride is the nitride to use.
We can deposit up to 4 micron of nitride using this method of nitride deposition.
Thickness range: 50Å – 2µm
Thickness tolerance: +/-5%
Within wafer uniformity: +/-5% or better
Wafer to wafer uniformity: +/-5% or better
Sides processed: both
Refractive index: 2.30 +/-.05
Film stress: <100MPa Tensile Stress
Wafer size: 50mm, 100mm, 125mm, 150mm, 200mm
Wafer thickness: 100µm – 2,000µm
Wafer material: Silicon, Silicon on Insulator, Quartz
Gases: Dichlorosilane, Ammonia
Equipment: Horizontal vacuum furnac
Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China.PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices.PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.
With more than 25+years experiences in compound semiconductor material field and export business, our team can assure you that we can understand your requirements and deal with your project professionally.