Tag - semiconductor wafer

Silicon full wafer bonding with atomic layer deposited titanium dioxide and aluminum oxide intermediate films

Silicon full wafer bonding with atomic layer deposited titanium dioxide and aluminum oxide intermediate films Silicon-on-insulator (SOI) wafers made by direct wafer bonding are widely used as starting substrates for microelectromechanical systems (MEMS) fabrication. Adding another layer next to the SiO2 SOI, or replacing it with another material, will be a way [...]

Computer modeling of surface interactions and contaminant transport in microstructures during the rinsing of patterned semiconductor wafers

Computer modeling of surface interactions and contamin Highlights • Dynamics of contaminant removal from the surface of micro/nanotrench is simulated. • The trench is rectangular and made of one or two different materials. • Various diffusivities and surface characteristics are considered in the model. • In multimaterial trench, cleaning dynamics strongly depends on stacking order. • Dynamics has two regimes [...]