Tag - semiconductor wafer manufa

Silicon full wafer bonding with atomic layer deposited titanium dioxide and aluminum oxide intermediate films

Silicon full wafer bonding with atomic layer deposited titanium dioxide and aluminum oxide intermediate films Silicon-on-insulator (SOI) wafers made by direct wafer bonding are widely used as starting substrates for microelectromechanical systems (MEMS) fabrication. Adding another layer next to the SiO2 SOI, or replacing it with another material, will be a way [...]