testing project: Orientation

testing project: Orientation

Wafers are grown from crystals with regular crystal structure. When a wafer is cut, the surface is aligned in one of several relative directions called crystal orientation. Orientation is defined by the miller index, where (0001) or (0001)4deg. surfaces are the most common surfaces in silicon carbide. orientation is important because the structure and electron properties of many single crystals are highly anisotropic. The depth of ion implantation depends on the crystal orientation of the wafer, because each direction provides a different transmission path. wafer cleavage usually occurs only in a few well-defined directions. Cutting the wafer along the cleavage allows it to be easily cut into a single wafer (the “core”), allowing the average chip to have billions of individual circuit elements divided into many separate circuits.

Test equipment:  X-ray Orientator

Test Standard:

Test result: degree

testing project: Orientation

 

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