PAM XIAMEN offers Ti – Titanium Substrate ( Polycrystalline).
General Properties for Titanium
Symbol Ti
Atomic Number 22
Atomic Weight: 47.867
Crystal structure: HCP
Lattice constant at room temperature a: 0.295 nm
Lattice constant at room temperature b: 0.468 nm
Density: 4.506 g/cm3
Melting Point: 1668°C
Boiling Point: 3287°C
Titanium (Ti) Metallic Substrate: 0.5″x0.5 mm, 1side polished
Titanium (Ti) Metallic Substrate: 1″x0.5 mm, 1side polished
Titanium (Ti) Metallic Substrate: 1″x1″x0.5 mm, 1side polished
Titanium (Ti) Metallic Substrate: 10x10x0.5 mm, 1side polished
Titanium (Ti) Metallic Substrate: 10x5x0.5 mm, 1side polished
Titanium (Ti) Foil: 110mm Width x 0.1mm thick x 700 mm Length
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Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China. PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices. PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.
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