We are an expert of semiconductor wafers in semiconductor industry, and we offer technology support and wafers selling for thousands of univerisities and industrial customers by our decades experience, including Cornell University, Stanford Univeristy,Peking University, Shandong Univerity, university of south carolina,Caltech Faraon lab (USA）,University of California, Irvine (USA),Singapore MIT Alliance for Research and Technology Centre (SMART),West Virginia University,Purdue Univerity, University of California, Los Angeles,King Abdullah University of Science & Technology,Massachusetts Institute of Technology,University of Houston,University of Wisconsin,University of Science and Technology of China etc.
And now we show one article example as follows, who bought our wafers or service:
Article title:GaN LEDs fabricated using SF6 plasma RIE
Published by:
Wasif Khan ; Xiaopeng Bi ; Bin Fan ; Wen Li
Department of Electrical and [...]
2019-12-02meta-author
PAM XIAMEN offers 150mm&200mm Silicon Wafer.
Diameter
Type
Dopant
Growth
method
Orientation
Resistivity
Thickness
Surface
Grade
150
N
Phos
CZ
-100
1-20
180-200
P/P
PRIME
150
N
Phos
CZ
-100
1-100
500-550
P/P
PRIME
150
N
Phos
CZ
-100
1-100
500-600
P/E
TEST
150
N
Phos
CZ
-100
1-100
650-700
P/E/DTOx
PRIME
150
N
Phos
CZ
-100
1-100
650-700
P/E/Ni
PRIME
150
N
Phos
CZ
-100
1-20
650-700
P/E/OX
PRIME
150
N
Phos
CZ
-100
1-20
650-700
P/E/WTOx
150
P
Boron
CZ
-100
1-20
180-200
P/P
PRIME
150
P
Boron
CZ
-100
1-100
500-550
P/P
PRIME
150
P
Boron
CZ
-100
1-100
500-600
P/E
TEST
150
P
Boron
CZ
-100
.001-.005
650-700
P/E
PRIME
150
P
Boron
CZ
-100
1-100
650-700
P/E/DTOx
PRIME
150
P
Boron
CZ
-100
1-100
650-700
P/E/Ni
PRIME
150
P
Boron
CZ
-100
1-20
650-700
P/E/OX
PRIME
150
P
Boron
CZ
-100
1-20
650-700
P/E/WTOx
150
P
Boron
CZ
-100
1-20
950-1050
P/E
PRIME
150
P
Boron
CZ
-100
1-20
950-1050
P/P
PRIME
150
Undoped
VGF
-100
>1E7
500-600
P/P
150
Undoped
VGF
-100
>1E7
500-600
P/P
150
N
Si
VGF
-100
650-700
P/E
PRIME
150
P
Zn
VGF
-100
650-700
P/E
PRIME
150
Si
Undoped
VGF
-100
>1E7
500-600
P/P
TEST
150
Si
Undoped
VGF
-100
>1E7
500-600
P/P
TEST
150
Si
Undoped
VGF
-100
>1E7
610-660
P/P
EPI
150
Si
Undoped
VGF
-100
>1E7
650-700
P/E
PRIME
150
Single Wafer Shipper
ePak
Lid/Base/Spring
Holds1Wafer
Clean Room
150
Round
Single Wafer Shipper
ePak
Lid/Base/Spring
Holds1Wafer
Clean Room
150
Shipping Cassette
ePak
Holds25Wafers
Clean Room
200
N
Phos
CZ
-100
1-20
700-750
P/E/OX
PRIME
200
P
Boron
CZ
-100
1-100
600-800
P/E
TEST
200
P
Boron
CZ
-100
1-20
700-750
P/E/OX
PRIME
For more information, please visit our website: https://www.powerwaywafer.com,
send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com
Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in [...]
2019-03-04meta-author
PAM XIAMEN offers 2004nm laser diode wafers.
Available Center Wavelengths: 1970 nm – 2051 nm
Wavelength Tolerance: +/- 1nm
CW Output Power (typical): 3mW (out of fiber)
SMSR (typical): >40 dB
Optical Linewidth: < 1.5 MHz
Temperature Tuning Coefficient (typical): 0.1 nm/°C
Current Tuning Coefficient (typical): 12 pm/mA
Slope Efficiency (typical): 0.12 [...]
2019-03-13meta-author
New research of SiC and GaN technology along with LED technology can be shared, and we can send you paper content if you want. Please see below article title:
No.1 Technologies for Power Electronics and Packaging (SiC & GaN)
1-1.The latest development of SiC power devices
1-2.New Progress of SiC high voltage power electronic devices and applications
1-3.SiC MOSFET Device Structure and Process Study
1-4.Electro-thermal Analysis of 1.2kV-100A SiC JBS Diodes Under Current Overload
1-5.Graphene-on-SiC for gas detection and bio-sensors
1-6.Packaging of high-voltage wide-bandgap power semiconductors
1-7.High power & high temperature IGBT and WIDE bandgap power semiconductor modual package
1-8.Design and TCAD Simulation of Widegap Semiconductor Devices
1-9.GaN Power Devices Beyond 650V and 150C
1-10.High-breakdown voltage GaN HEMTs fabricated on semi-insulating GaN substrates
1-11.A Gate Driver IC for E-mode GaN HEMTs with Reverse Conduction Detection
1-12.Development of Normally-off AlGaN/GaN HFETs for Power Electronics
1-13.High crystal quality GaN-on-Si to achieve excellent isolation and dynamic performance without carbon doping
1-14.200mm/8-inch GaN power device and GaN-IC technology: a new opportunity for wafer suppliers, foundries and IDMs
1-15.200mm 40V-650V E-mode GaN-on-Si Power Technology: from Device, Package, Reliability to System
1-16.GaN, Power the Future
1-17.AlGaN/GaN heterostructure pH sensors with high Al composition in the barrier layer
1-18.In-situ Wafer Cleaning for Pre-Epitaxial Deposition for Next Generation Semiconductor Devices
No.2 Micro-LED and other Novel Display
2-1.A New Concept for Fabricating CMOS-driven, High-Performance MicroLED Displays
2-2.Study on three dimensional thermal transport in micro-LEDs at the level of kW/cm2
2-3.1 bin wavelength uniformity on 200 mm GaN-on-Si LED for micro LED application with precise strain-engineering
2-4.Integration of III-V LEDs with Silicon Thin Film Transistors for Micro-LED Displays
2-5.NAURA product solutions for Mini-LED and Micro-LED
2-6.Driving Micro LED to future Lighting and Display
2-7.Growth and fabrication of semi / non-polar LEDs and Micro-LEDs using nano-patterning technology
2-8.Imaging Light Measurement Device for Subpixel evaluation of Micro-LED and OLED Displays
2-9.China LED Display Application Industry Development Report 2018-2019
2-10.Enabling the Next Era of Display Technologies by Micro LED MOCVD Processing
2-11.Research Progress and Prospects of LED Chips for Next Generation Display Application
2-12.Influence of the Charge Transfer on the Lifetime of Quantum-Dot Light-Emitting Diodes
2-13.Low toxic quantum dots polymer nanocomposites for LED applications
2-14.Micro/Mini-LED: From Backlight to Direct-view Display
2-15.Application of COB Integrated Packaging Technology in UHD LED Display Field
2-16.Prospect analysis of the 4-in-1 technical approach in LED Display Field
2-17.Mini LED, Future Directions and Solutions – from Chipone Technology
2-18.Progress in Cooperation Between LCD and LED Industry
No.3 Technologies for Ultra-Wide Bandgap Semiconductor
3-1.An (AlxGa1-x)2O3 metal-semiconductor-metal VUV photodetector
3-2.Growth and Characterization of Ultra-Wide Bandgap Oxide Semiconductors
3-3.Progress of diamond ultra-wide-band-gap semiconductor material and devices
3-4.Application of Polycrystalline Diamond Micro-nano Powder in SiC Wafer Processing and Its Key Process Technology
3-5.Epitaxial Growth of Hexagonal Boron Nitride Films on AlN/Sapphire Templates by MOVPE
3-6.Preparation and photoelectric properties of BN films by RF-sputtering
3-7.High quality h-BN thin films and their application as flexible buffer layer for III-nitrides epitaxy
No.4 The Technology in Substrate, Epitaxy and Wafer Growth Equipment (SiC&GaN)
4-1.Synchrotron x-ray diffraction-based visualization of lattice-plane tilting of a GaN substrate and epitaxial film
4-2.In situ coherent x-ray studies of surface dynamics during OMVPE of GaN
4-3.Modeling of SiC crystal growth and epitaxy and simulation of GaN Metal Organic Vapor Deposition
4-4.The effect of n-p electrodes upon the p-type conductivity of B0.375GaN/B0.45GaN QW/QB edge emitting laser diode grown over sapphire substrate
4-5.INDUSTRY4.0 as A Major Opportunity for Electronics Processes and Products
4-6.Interrelationship Between Equipment and PVT Crystal Growth in Silicon Carbide
4-7.Advanced Chemical Concentration Control for Fabrication of Devices Using SiC
4-8.The step growth mechanism for 4H-SiC with Improved Single Polytypes
4-9.Investigation of Defect Levels of Al/Ti 4H-SiC Schottky Structures by Deep Level Transient Spectroscopy
No.5 LED Chip, Packaging, and Modules
5-1.Possible Futures for LEDs and LED Packaging
5-2.Beyond Illumination | Latest Photonics Technology, Breakthrough and Application Trend
5-3.Violet Chip Excited White LEDs for Sun-Like Lighting and Horticulture Lighting
5-4.Research and application for warm white LED of high-efficiency tri-color rare earth Phosphors by purple light Excitation
5-5.Recent progress of fluorescent materials for high-power LED
5-6.Simultaneously improve the luminous efficiency and color rendering index of GaN-based white light emitting diodes using metal localized surface plasmon resonance
5-7.Thermal Simulations of a UV LED module with nanosilver sintered die attach process on graphene coated copper substrates
5-8.Recent progress on massive transfer and integration technologies of Mini & Micro-LEDs
5-9.Anisotropic Conductive Paste and Grip Ring Direct process for mini LED die attachment
5-10.Monolithic Integrated Device of GaN Micro-LED with Graphene Transparent Electrode and Graphene Driving Transistor
5-11.GaN/Si LEDs: Towards Longer Wavelength and Smaller Current Density
5-12.Recent Advances in Achieving Ultra-High Efficiency InGaN-based LEDs
5-13.The effect of air-cavity structure on the process of vertical GaN-based light emitting diodes
5-14.A Wavelength Stabilized GaN based Laser Utilizing Distributed Bragg Reflector
No.6 RF Technology and 5G Mobile Communication
6-1.The Epi structure and Process Considerations of 6-inch GaN RF HEMT for 5G applications
6-2.High frequeny GaN HEMTs and MMICs
6-3.5G mm Wave
6-4.High-frequency GaN-on-Si transistors
6-5.Development and trend of 5G RF Devices and Circuits
6-6.High-linearity GaN HEMTs for millimeter-wave applications
6-7.A Highly Integrated Multi-Parameters RF Module for Microwave Semiconductor Testing
6-8.A Compact X-band Pallet Power Amplifier Using GaN MMIC and Discrete FETs with HMIC Technology
No.7 [...]
2019-12-02meta-author
PAM XIAMEN offers Magnesium ( Mg ) Single Crystal Substrate.
Magnesium ( Mg ) Single Crystal Substrate , <0001> orn. 5x5x0.9-1.0mm, 1SP
Magnesium ( Mg) Polycrystaline Substrate , 10x10x2.0mm, as Cut
Magnesium ( Mg) Single Crystal Substrate , <0001> orn. 10x10x0.85-1.0mm, 1SP
Magnesium ( [...]
2019-05-10meta-author
AMCA-01 is an analog multi-channel equipment which used for energy spectrum analyze for variety of radiations detectors. Added with upper computer software, it can collect analog energy spectral signal, drawing energy spectrum and analyzing it, and counting full energy peak resolution. The software also [...]
2019-04-25meta-author
