2-37. Lớp kiểm tra thử nghiệm: Một tấm wafer silicon cacbua có chất lượng thấp hơn Prime và được sử dụng chủ yếu cho các quy trình thử nghiệm. SEMI cho biết khối lượng lớn, bề mặt và các đặc tính vật lý cần thiết để ghi nhãn tấm wafer cacbua silicon là “Tấm thử nghiệm”.
2018-06-28siêu tác giả
1-2.Stacking Sequence
If we are going to make a laminated structure, we must know the thickness of each ply and the angle of each ply traditionally in degrees defined from the top layer down.
2018-06-28siêu tác giả
Total Thickness Variation (TTV): The maximum variation in the wafer thickness. Total Thickness Variation is generally determined by measuring the wafer in 5 locations of a cross pattern (not too close to the wafer edge) and calculating the maximum measured difference in thickness. The [...]
2018-06-28siêu tác giả
2-7.Primary Flat Orientation
The at of the longest length on the wafer, oriented such that the chord is parallel with a specied low index crystal plane. Measured on one wafer per ingot using Laue back-reection technique with manual angle measurement.
2018-06-28siêu tác giả
5-4 SiC Semiconductor Crystal Growth
As of this writing, much of the outstanding theoretical promise of SiC electronics highlighted in the
previous section has largely gone unrealized. A brief historical examination quickly shows that serious
shortcomings in SiC semiconductor material manufacturability and quality have greatly hindered the
development [...]
2018-06-28siêu tác giả
5-6-1 SiC Optoelectronic Devices
The wide bandgap of SiC is useful for realizing short-wavelength blue and ultraviolet (UV) optoelectronics.
6H-SiC-based pn junction light-emitting diodes (LEDs) were the first semiconductor devices
to cover the blue portion of the visible color spectrum, and became the first SiC-based devices to [...]
2018-06-28siêu tác giả