PAM XIAMEN offers CdSe single crystal.
CdSe single crystal substrate, (0001) 10x10x1.0mm, 2sp Low Resistivity
CdSe single crystal
Orientation: (0001)
Type: N
Sizes: 10 x 10 +/- 0.1 mm
Thickness: 1.0 +/- 0.1 mm
Resistivities: < 1 ohm-cm
Surface Quality: two sides optical polished [...]
2019-04-19메타 저자
With the increasing development of semiconductor devices, silicon and silicon-based materials still show their superior properties, and it will still be an important material for semiconductor devices and integrated circuits. With the decreasing size of devices, the resistivity, impurity distribution, film thickness and quality [...]
2022-08-30메타 저자
PAM XIAMEN은 테스트 등급 실리콘 웨이퍼를 제공합니다. 아래는 테스트 등급 실리콘 기판의 짧은 목록입니다! 인치 Cust 클래스 도펀트 유형 방향 PFL 길이 PFL 방향 SFL 꺼짐 방향 저항률 직경 두께 Bow TTV Warp 6 DSP Boron P 100 0,0 ± 0,0 110 ± 0,20 0.0 ± 0.1 ° 1 – 20 Ohmcm 150.0 ± 0.2 mm 675 ± 5 µm 60 3 6 DSP 붕소 P 100 57,5 ± 2,5 110 ± 0,50 0.0 ± 0.5° 30 – [...]
2019-02-25메타 저자
PAM-XIAMEN offers 950nm InGaAs quantum well laser diode wafers. In the application of optoelectronic devices, the InGaAs / GaAs strained quantum well (QW) structure is one of the research hotspots, and the emission band of the InGaAs / GaAs strained quantum well covers the [...]
2019-03-13메타 저자
PAM XIAMEN offers 4″ (100mm) black lithium niobate (LiNbO3) 127.860Y-cut black wafer for Optics and SAW components
1. Dimension
Diameter/mm
100.0±0.3
Orientation Flat (OF)/mm
32.0±1.0
Second Refer. Flat (RF)/mm
10.0±3.0
Thickness/um
350±20
Edge bevel
Edge rounding
2. Specification
2.1 Orientation
Surface – cut:
127.860Y-cut±0.30
Orientation Flat (OF)
Parallel to +X Plane±0.30
Second Refer. Flat (RF)
CCW1350±0.50from OF
2.2 Flatness
TTV
≤5um
LTV
≤0.5um within an area of 5*5mm2
PLTV
≥95% (3mm [...]
2019-02-28메타 저자
PAM XIAMEN offers Bi12GeO20 (BGO20).
Bi12GeO20 – BGO20 (001) 10x5x1.0 mm 1 side polished
Features:
Crystal Bi12GeO20 ( BGO20) — New generation acousto-optic crystal Wafer size: 10 x 5 x1.0 mm thick
Orientation: (001) +/-0.5o
Polished surface: substrate surface is EPI polished via a special CMP procedure with RA < 5 A
1 sides polished
Package: Each wafer is packed in [...]
2019-04-17메타 저자
