Gravure isotrope et gravure anisotrope de tranche de silicium

PAM-XIAMEN can provide etching silicon wafer in P type and N type, more specifications please see: The etching of silicon wafers is divided into isotropy and anisotropy, shown as Fig. 1. Isotropy etching means that the etching rate of silicon in all directions is the same during the etching process, and the etching result is [...]

Comment nettoyer les tranches de silicium (Si) ?

As the basis for making photovoltaic cells and integrated circuits, silicon wafer cleaning is very important. The effect of cleaning directly affects the final performance, efficiency and stability of photovoltaic cells and integrated circuits. Cleaning the silicon wafer not only removes impurities on the surface of the silicon wafer [...]

Quelque chose à propos des semi-conducteurs intrinsèques et extrinsèques

There are three basic types of semiconductor materials: intrinsic semiconductors, extrinsic semiconductors, also known as impurity semiconductors. Both types of semiconductor materials can be supplied by PAM-XIAMEN. 1. What Is Intrinsic Semiconductor? Intrinsic semiconductor refers to a pure semiconductor that is completely free of impurities and lattice defects, and generally such [...]

Contrôle de la profondeur à l'échelle nanométrique des lacunes de silicium peu profondes implantées dans le carbure de silicium

We are an expert of semiconductor wafers in semiconductor industry, and we offer technology support and wafers selling for thousands of univerisities and industrial customers by our decades experience, including Cornell University, Stanford Univeristy, Peking University, Shandong Univerity, university of south carolina, Caltech Faraon lab (USA) ,University of Califomia, [...]

Pourquoi l'amincissement des plaquettes est-il nécessaire ?

From the perspective of the cross-sectional structure of integrated circuits, most integrated circuits are fabricated on the shallow surface layer of the silicon base material. Due to the requirements of the manufacturing process, high requirements are placed on the dimensional accuracy, geometric accuracy, surface cleanliness and surface micro lattice [...]