2-13.육각판

2-13.육각판

관련 게시물

5-6-4-1-2 Bipolar and Hybrid Power Rectifiers

5-6-4-1-2 Bipolar and Hybrid Power Rectifiers For higher voltage applications, bipolar minority carrier charge injection (i.e., conductivity modulation) should enable SiC pn diodes to carry higher current densities than unipolar Schottky diodes whose drift regions conduct solely using dopant-atom majority carriers . Consistent with silicon [...]

2018-06-28메타 작성자
1-6.Refraction Index

In optics the refractive index (or index of refraction) n of a substance (optical medium) is a number that describes how light, or any other radiation, propagates through that medium. Refractive index is the basic property of optical crystals, and it is an important parameter [...]

2018-06-28메타 작성자
5-6-3 SiC High-Temperature Signal-Level Devices

Most analog signal conditioning and digital logic circuits are considered “signal level” in that individual transistors in these circuits do not typically require any more than a few milliamperes of current and <20 V to function properly. Commercially available silicon-on-insulator circuits can perform complex digital and [...]

2018-06-28메타 작성자
2-17.Polytypes

2-17.Polytypes Many compound materials exhibit polymorphism, that is they can exist in different structures called polymorphs. Silicon carbide (SiC) is unique in this regard as more than 250 polymorphs of silicon carbide had been identified by 2006,with some of them having a lattice constant as [...]

2018-06-28메타 작성자
5-5 SiC Device Fundamentals

5-5 SiC Device Fundamentals To minimize the development and production costs of SiC electronics, it is important that SiC device fabrication takes advantage of existing silicon and GaAs wafer processing infrastructure as much as possible. As will be discussed in this section, most of the [...]

2018-06-28메타 작성자
2-28.WARP

2-28.WARP Warp is the difference between the maximum and the minimum distances of the median surface of a free, un-clamped wafer from the reference plane defined above. This definition follows ASTM F657, and ASTM F1390,which deviation from a plane of a slice or wafer centerline [...]

2018-06-28메타 작성자