5-6-5 SiC MicroElectromechanical Systems (MEMS) and Sensors
As described in Hesketh’s chapter on micromachining in this book, the development and use of siliconbased MEMS continues to expand. While the previous sections of this chapter have centered on the use of SiC for traditional semiconductor electronic [...]
2018-06-28メタ著者
5-6-4-2 SiC High-Power Switching Transistors
Three terminal power switches that use small drive signals to control large voltages and currents (i.e., power transistors) are also critical building blocks of high-power conversion circuits. However, as of this writing, SiC high-power switching transistors are not yet commercially [...]
2018-06-28メタ著者
2-19.Scratches
A scratch is dened as a singular cut or groove into the frontside wafer surface with a length-to-width ratio of greater than 5 to 1, and visible under hight intensity illumination.
2018-06-28メタ著者
1-1.lattice parameter
The lattice constant, or lattice parameter, refers to the constant distance between unit cells in a crystal lattice. Lattices in three dimensions generally have three lattice constants, referred to as a, b, and c. However, in the special case of cubic crystal structures, [...]
2018-06-28メタ著者
5-4-1 Historical Lack of SiC Wafers
Reproducible wafers of reasonable consistency, size, quality, and availability are a prerequisite for
commercial mass production of semiconductor electronics. Many semiconductor materials can be melted
and reproducibly recrystallized into large single crystals with the aid of a seed crystal, such as [...]
2018-06-28メタ著者
2-18.粒界 異なる方位の結晶が出会う界面です。 粒界は単相界面であり、境界の両側の結晶は方向を除いて同一です。 「結晶子境界」という用語は、まれではありますが、時々使用されます。 粒界領域にはそれらが含まれています [...]
2018-06-28メタ著者