PAM XIAMEN offers 4″ CZ Prime Silicon Wafer Thickness 200um.
4inch Prime CZ-Si wafer 4 inch (+/- 0.5 mm), thickness = 200 ± 25 µm,
orientation (100)(+/-0.5°),
2-side polished,
p or n type (no matter) ,
? Ohm cm (no matter),
Particle: 0.33µm, <qty30 [...]
2019-06-28meta-author
PSA-01 is a portable nuclear spectrum acquisition instrument, which integrates main amplifier,multi-channel pulse analyzer and high-voltage. Its gain, high-voltage and shaping time are adjustable. With upper computer software, it can acquit nuclear spectrum, analyzing, processing and storage data. Its built-in Li-battery could charge more [...]
2019-04-25meta-author
5-5-3 SiC Contacts and Interconnect
All useful semiconductor electronics require conductive signal paths in and out of each device as well as
conductive interconnects to carry signals between devices on the same chip and to external circuit
elements that reside off-chip. While SiC itself is theoretically capable [...]
2018-06-28meta-author
Highlights
•The barrier controlled trapping model was developed around extended defects.
•Electron mobility and E-field distribution were distorted by space charge depletion region.
•Extended defects act as a recombination-activated region.
•The relationships between extended defects and detector performance were established.
Transient current techniques using alpha particle source were utilized [...]
PAM XIAMEN offers BaSrTiO3 Film on substrate.
BaSrTiO3 Film ( 400nm) on Nb.SrTiO3(wt 0.7%), 10x10x0.5mm,1sp
Ba1-xSrxTiO3 is an excellent enhanced dielectronic film grown on Nb doped SrTiO3 conductive substrate via special spin coating:
Film Sppecifications:
Chemical composition: BaSrTiO3
Film thickness: ~ 400 nm
Crystalline: Polycrystal
Growth [...]
2019-04-26meta-author
– How to Improve the Reliability of Silicon Carbide Materials?
The silicon carbide industry chain includes silicon carbide powder, silicon carbide ingots, silicon carbide substrates, silicon carbide epitaxy, silicon carbide wafers, silicon carbide chips and silicon carbide device packaging. Among them, substrate, epitaxial wafer, wafer, [...]
2021-04-07meta-author