12″ Prime Grade Silicon Wafer

PAM-XIAMEN Offer 300mm bare silicon wafers (12 inch) in prime grade, n type or p type. Compared to other silicon wafer suppliers, Powerway Wafer’s silicon wafer prices are more competitive with higher quality.

  • Description

Product Description

PAM-XIAMEN Offers 12″ Prime Grade Silicon Wafer

PAM-XIAMEN Offer 300mm bare silicon wafers (12 inch) in prime grade, n type or p type. Compared to other silicon wafer suppliers, Powerway Wafer’s silicon wafer prices are more competitive with higher quality. 300mm silicon wafers have a higher yield per wafer than pervious large diameter silicon wafers.  Size on/above 8 inches (200 mm) is called a large silicon wafer. The production technology of large silicon wafer is not only the increase of process complexity because of the increase of area, but also the higher requirements on many other control factors. For example: oxygen content and its radial uniformity in wafer, impurity control, OISF control, etc. The silicon wafer requirements for defect control, oxygen precipitation control, resistance quantification, doping and radial uniformity are also higher. Especially for prime grade 300mm silicon wafer, some parameters are required critically, for instant, wafer TTV is below1.5um and defect density ~0/cm2. The next step is 450mm silicon ingot or wafer.

 

Parameters Value
Type of ingot Grown according to the Czochralski method
Diametr, mm 300 ± 0,2
Dopant B (boron)
Conductivity type P
Oxigen max, OLD-PPMA 40
Carbon , PPMA 1
Crystallographic orientation <100>
Deviation from the predetermined surface orientation of crystal plane, deg 1
Volume resistivity, Ohm · cm 8-12
Primary Notch Yes
Notch Location 110
Notch size, mm 2,3
Notch Form V
Wafer thickness, microns 775±15
Type of marking Laser
Marking Location back side
Edge profile by SEMI T/4
Scratches on the front side absent
Front side polishing yes
Back side polishing yes
Total change in wafer thickness (TTV), micrometers 1,5
Deflection (WARP), microns 30
The number of particles on a surface larger than 0.05 microns 50
The number of particles on a surface larger than 0.09 microns 30
Surface content of aluminium, E10AT/CM2 1
Surface content of calcium, E10AT/CM2 1
Surface content of chromium, E10AT/CM2 1
Surface content of copper, E10AT/CM2 1
Surface content of iron, E10AT/CM2 1
Surface content of potassium, E10AT/CM2 1
Surface content of natrium, E10AT/CM2 1
Surface content of nickel, E10AT/CM2 1
Surface content of zinc, E10AT/CM2 1

 

Packing requirements:

Parameters
Type of packaging MW300GT-A
Inner Container Material Polyethylene
Outer Packing Material Aluminum
Number of pieces in one package 25
Reusability Yes

 

FAQ: 

Please take note that we offer “The number of particles on a surface larger than 0.09 microns  50” just for silicon substrate.

Normally the particle requirement is for silicon substrate.

To ensure the compliance, could you please check?

Answer: 

We double-checked: Yes, the indicated information is correct.

 

PAM-XIAMEN can offer you technology and wafer support.

For more information, please visit our website: https://www.powerwaywafer.com/silicon-wafer,

send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com