Wafer List

Glass Wafer

Glass Wafer We are one of the world’s leading glass wafer suppliers, provide thin & ultra-thin glass wafers and substrates which are made of different materials, such as Borofloat, Fused Silica & Quartz, BK7, Soda Lime etc for MEMS, fiber optic AWG, LCD panels and OLED substrates application. These wafers are all SEMI Standards including dimensional, flat and notch specifications, also we offer [...]

Single Crystal

Single Crystal CeO2 Crystal Fe3O4 Crystal SnO2 Crystal Cu2O Crystal Fe2O3 Crystal MnO Crystal PrScO3 Crystal Substrate NdScO3 Crystal Substrate NdScO3 Crystal Substrate GdScO3 Crystal Substrate DyScO3 Crystal Substrate SOI Wafer Ti Terminal SrTiO3 HOPG(highly oriented pyrolytic graphite) ZnO/cAl2O3 Film AIN on Sapphire Wafer

Epi/Thin Film on Substrate

Epi/Thin Film on Substrate GaN Substrate/Template SiO2+Si3N4 on Silicon wafer Substrate GaAs/AlGaAs  on GaAs (Si) Substrate SiC 4H Film on  4H-SiC Substrate AlN Thin Film Substrate Aluminum Film Substrate Silicon Nitride on Corning 7980 Substrate La0.7Sr0.3MnO3 + PbZr(x)Ti(1-x)O3 on Nb(SrTiO3) substrate Diamond on Silicon Wafer Substrate Ag Conductive Film(Planarized silver nanowir)substrate FTO Film on Substrates Silicon Nitride on Silicon substrate La0.5Sr0.5TiO3  film substrate Au-coated [...]

Superconductor Substrates

Superconductor Substrates Crystal Structure M.P. Density Thermal Expansion Dielectric constant Growth Tech. & max. size standard 1or 2 sides epi polished wafer oC g/ cm3   LSAT Cubic 1840 6.74 10 22 CZ 20x20x0.5mm (LaAlO3)0.3 -(Sr2AlTaO8)0.7 a=3.868 Å Ø35mm 10x10x0.5mm LaAlO3 Rhombo. 2100 6.51 9.2 24.5 CZ Ø3″x0.5mm a=3.790 Å Ø3″ Ø2″x0.5mm c=13.11 Å   Ø1″x0.5mm     10x10x0.5mm MgO Cubic 2852 3.58 12.8 9.8 Flux Ø2″x0.5mm a=4.21 Å Ø2″ 10x10x0.5mm NdGaO3 Orthor. 1600 7.57 7.8 25 CZ Ø2″x0.5mm a=5.43 Å Ø2″ 10x10x0.5mm b=5.50 Å     c=7.71 Å     SrTiO3 Cubic 2080 5.12 10.4 300 vernuil 10x10x0.5mm a=3.90 Å Ø30mm SrLaAlO4 Tetrag. 1650 16.8 CZ 10x10x0.5mm a=3.756 Å Ø20mm c=12.63 Å   YAlO3 Orthor. 1870 4.88 2 ~ 10 16`20 CZ 10x10x0.5mm a=5.176 Å b=5.307 Å Ø30mm c=7.355 Å   YSZ Cubic ~2500 5.8 10.3 27 Flux Ø2″x0.5mm a=5.125 Å Ø2″ 10x10x0.5m

Substrates for III-V Nitride Film Deposition

Substrates for III-V nitride Film Deposition Crystal Structure M.P. Density Lattice Mis-match to GaN Thermal Expansion Growth Tech. .& Max size Standard substrate size (mm) oC g/cm3 (10-6/k) SiC (6H as example) Hexagonal ~2700 3.21 3.5 % atori. 10.3 CVD Ø2″ x 0.3,Ø3″x0.3 a=3.073  Å     20x20x0.3,15x15x0.3 c=15.117 Å   Ø3“ 10x10x0.3,5x5x0.3   subl.   1 side epi polished Al2O3 Hexagonal 2030 3.97 14% atori. 7.5 CZ Ø50 x 0.33 a=4.758 Å   Ø25 x 0.50 c=12.99 Å Ø2” 10x10x0.5     1 or 2 sides epi polished LiAlO2 Tetragonal 1900 ~ 2.62 1.4 % atori. / CZ 10x10x0.5 a=5.17 Å Ø20 mm 1 or 2 sides epi [...]

Silicon Carbide List

Silicon Carbide List   4″ 4H Silicon Carbide Item No. Type Orientation Thickness   Grade Micropipe Density Surface Usable area    N-Type  S4H-100-N-SIC-350-A 4″ 4H-N 0°/4°±0.5° 350±25um A  <10/cm2 P/P >90% S4H-100-N-SIC-350-B 4″ 4H-N 0°/4°±0.5° 350±25um B < 30/cm2 P/P >85% S4H-100-N-SIC-350-D 4″ 4H-N 0°/4°±0.5° 350±25um D  <100/cm2 P/P >75% S4H-100-N-SIC-370-L 4″ 4H-N 0°/4°±0.5° 370±25um D * L/L >75% S4H-100-N-SIC-440-AC 4″ 4H-N 0°/4°±0.5° 440±25um D * As-cut >75% S4H-100-N-SIC-C0510-AC-D 4″ 4H-N 0°/4°±0.5° 5~10mm D  <100/cm2 As-cut * S4H-100-N-SIC-C1015-AC-C 4″ 4H-N 0°/4°±0.5° 5~10mm C  <50/cm2 As-cut * 3″ 4H Silicon Carbide Item No. Type Orientation Thickness   Grade Micropipe Density Surface Usable area            N-Type  S4H-76-N-SIC-350-A 3″ 4H-N 0°/4°±0.5° 350±25um A  <10/cm2 P/P >90% S4H-76-N-SIC-350-B 3″ 4H-N 0°/4°±0.5° 350±25um B < 30/cm2 P/P >85% S4H-76-N-SIC-350-D 3″ 4H-N 0°/4°±0.5° 350±25um D  <100/cm2 P/P >75% S4H-76-N-SIC-370-L 3″ 4H-N 0°/4°±0.5° 370±25um D * L/L >75% S4H-76-N-SIC-410-AC 3″ 4H-N 0°/4°±0.5° 410±25um D * As-cut >75% S4H-76-N-SIC-C0510-AC-D 3″ 4H-N 0°/4°±0.5° 5~10mm D  <100/cm2 As-cut * S4H-76-N-SIC-C1015-AC-D 3″ 4H-N 0°/4°±0.5° 10~15mm D  <100/cm2 As-cut * S4H-76-N-SIC-C0510-AC-C 3″ 4H-N 0°/4°±0.5° 5~10mm C  <50/cm2 As-cut * S4H-76-N-SIC-C1015-AC-C 3″ 4H-N 0°/4°±0.5° 10~15mm C  <50/cm2 As-cut *   SEMI-INSULATING  S4H-76-SI-SIC-350-A 3″ 4H-SI 0°/4°±0.5° 350±25um A  <10/cm2 P/P >90% S4H-76-SI-SIC-350-B 3″ 4H-SI 0°/4°±0.5° 350±25um B < 30/cm2 P/P >85% S4H-76-SI-SIC-350-D 3″ 4H-SI 0°/4°±0.5° 350±25um D  <100/cm2 P/P >75% 2″ 4H Silicon Carbide Item No. Type Orientation Thickness   Grade Micropipe Density Surface Usable area   N-Type  S4H-51-N-SIC-330-A 2″ 4H-N 0°/4°±0.5° 330±25um A  <10/cm2 C/P >90% S4H-51-N-SIC-330-B 2″ 4H-N 0°/4°±0.5° 330±25um B < 30/cm2 C/P >85% S4H-51-N-SIC-330-D 2″ 4H-N 0°/4°±0.5° 330±25um D  <100/cm2 C/P >75% S4H-51-N-SIC-370-L 2″ 4H-N 0°/4°±0.5° 370±25um D * L/L >75% S4H-51-N-SIC-410-AC 2″ 4H-N 0°/4°±0.5° 410±25um D * As-cut >75% S4H-51-N-SIC-C0510-AC-D 2″ 4H-N 0°/4°±0.5° 5~10mm D  <100/cm2 As-cut * S4H-51-N-SIC-C1015-AC-D 2″ 4H-N 0°/4°±0.5° 10~15mm D  <100/cm2 As-cut * S4H-51-N-SIC-C0510-AC-C 2″ 4H-N 0°/4°±0.5° 5~10mm C  <50/cm2 As-cut * S4H-51-N-SIC-C1015-AC-C 2″ 4H-N 0°/4°±0.5° 10~15mm C  <50/cm2 As-cut * 2″ 6H Silicon Carbide Item No. Type Orientation Thickness   Grade Micropipe Density Surface Usable area   N-Type  S6H-51-N-SIC-330-A 2″ 6H-N 0°/4°±0.5° 330±25um A  <10/cm2 C/P >90% S6H-51-N-SIC-330-B 2″ 6H-N 0°/4°±0.5° 330±25um B < 30/cm2 C/P >85% S6H-51-N-SIC-330-D 2″ 6H-N 0°/4°±0.5° 330±25um D  <100/cm2 C/P >75% S6H-51-N-SIC-370-L 2″ 6H-N 0°/4°±0.5° 370±25um D * L/L >75% S6H-51-N-SIC-410-AC 2″ 6H-N 0°/4°±0.5° 410±25um D * As-cut >75% S6H-51-N-SIC-C0510-AC-D 2″ 6H-N 0°/4°±0.5° 5~10mm D  <100/cm2 As-cut * S6H-51-N-SIC-C1015-AC-D 2″ 6H-N 0°/4°±0.5° 10~15mm D  <100/cm2 As-cut * S6H-51-N-SIC-C0510-AC-C 2″ 6H-N 0°/4°±0.5° 5~10mm C  <50/cm2 As-cut * S6H-51-N-SIC-C1015-AC-C 2″ 6H-N 0°/4°±0.5° 10~15mm C  <50/cm2 As-cut *   SEMI-INSULATING  S6H-51-SI-SIC-330-A 2″ 6H-SI 0°/4°±0.5° 330±25um A  <10/cm2 C/P >90% S6H-51-SI-SIC-330-B 2″ 6H-SI 0°/4°±0.5° 330±25um B < 30/cm2 C/P >85% S6H-51-SI-SIC-330-D 2″ 6H-SI 0°/4°±0.5° 330±25um D  <100/cm2 C/P >75% S6H-51-SI-SIC-370-L 2″ 6H-SI 0°/4°±0.5° 370±25um D * L/L >75% S6H-51-SI-SIC-410-AC 2″ 6H-SI 0°/4°±0.5° 410±25um D * As-cut >75% S6H-51-SI-SIC-C0510-AC-D 2″ 6H-SI 0°/4°±0.5° 5~10mm D  <100/cm2 As-cut * S6H-51-SI-SIC-C1015-AC-D 2″ 6H-SI 0°/4°±0.5° 10~15mm D  <100/cm2 As-cut *   As a SiC wafer supplier,we offer Silicon carbide list for your reference, if you need price detail, please contact our sales team. Note: *** As manufacturer, we also accept small quantity for researcher or foundry. ***Delivery time: it depends on stock we have, if we have stock, we can ship to you soon.

Nitride Semiconductor Wafer

Nitride Semiconductor Wafer Free-standing Gallium Nitride    Item No. Type Orientation Thickness   Grade Micro Defect Density Surface Usable area              N-Type     PAM-FS-GaN50-N 2″ N type 0°±0.5° 300±25um A/B 0/<2/cm2 P/P or P/L >90%    PAM-FS-GaN45-N dia.45mm,N type 0°±0.5° 300±25um A/B 0/<2/cm2 P/P or P/L >90%    PAM-FS-GaN40-N dia.40mm,N type 0°±0.5° 300±25um A/B 0/<2/cm2 P/P or P/L >90%    PAM-FS-GaN38-N dia.38mm,N type 0°±0.5° 300±25um A/B 0/<2/cm2 P/P or P/L >90%    PAM-FS-GaN25-N dia.25.4mm,N type 0°±0.5° 300±25um A/B 0/<2/cm2 P/P or P/L >90%    PAM-FS-GaN15-N 14mm*15mm,N type 0°±0.5° 300±25um A/B 0/<2/cm2 P/P or P/L >90%    PAM-FS-GaN10-N 10mm*10.5mm,N type 0°±0.5° 300±25um A/B 0/<2/cm2 P/P or P/L >90%    PAM-FS-GaN5-N 5mm*5.5mm, N type 0°±0.5° 300±25um A/B 0/<2/cm2 P/P or P/L >90%     SEMI-INSULATING     PAM-FS-GaN50-SI 2″ N type 0°±0.5° 300±25um A/B 0/<2/cm2 P/P or P/L >90%    PAM-FS-GaN45-SI dia.45mm,N type 0°±0.5° 300±25um A/B 0/<2/cm2 P/P or P/L >90%    PAM-FS-GaN40-SI dia.40mm,N type 0°±0.5° 300±25um A/B 0/<2/cm2 P/P or P/L >90%    PAM-FS-GaN38-SI dia.38mm,N type 0°±0.5° 300±25um A/B 0/<2/cm2 P/P or P/L >90%    PAM-FS-GaN25-SI dia.25.4mm,N [...]

Gallium Semiconductor Wafer

PAM-XIAMEN offers Indium Semiconductor Wafer: GaSb,GaAs, GaP GaSb Wafer Substrate – Gallium Antimonide Quantity Material (100)±0.5 50.8 500±25 SSP N/A Te 1E17 – 5E18 N/A < 1000 1-100 GaSb (111)B 50.8 N/A N/A N/A Te (5-8)E17 N/A N/A 1-100 GaSb (100)±0.5 50.8 500 SSP N/A P/ (1-5)E17cm-3 N/A N/A 1-100 GaSb (100)±0.5 50.8 500 SSP N/A N/Te (1-8)E17/(2-7)E16 N/A < 1000 1-100 GaSb (100) 50.8 350±25 SSP N/A N/A N/A N/A N/A 1-100 GaSb (100) 100 800±25 DSP N/A P/Zn N/A N/A N/A 1-100 GaSb Orientation. Diameter Thickness Polish Resistivity Type   Dopant Nc Mobility EPD PCS (mm) (μm) Ω·cm a/cm3 cm2/Vs /cm2 1-100 GaP (111)±0.5° 50±0.5 300 ± 20 N/A N/A S (2~7)×1E17 ≥100 <3×1E5 1-100 GaP

Ge Wafer Supplier

Ge Wafer Supplier Ge Wafer Substrate-Germanium Quantity Material Orientation. Diameter Thickness Polish Resistivity Type   Dopant Prime flat EPD Ra PCS (mm) (μm) Ω·cm   Orientation /cm2   1-100 Ge (100) 50.8 500±25 SSP 0.0138-0.02 P/Ga (110) ≤5000 N/A 1-100 Ge (100) 50.8 500 SSP ≥30 N/undoped N/A N/A <5A 1-100 Ge (100) 50.8 500 SSP 58.4-63.4 N/undoped N/A N/A N/A 1-100 Ge (100) 50.8 500 SSP 0.1-1 P/Ga N/A N/A N/A 1-100 Ge (100) 50.8 500 SSP 0.1-0.05 P/Ga N/A N/A N/A 1-100 Ge (100) 50.8 1000 DSP >30 N/A (110) N/A N/A 1-100 Ge (100) 50.8 2000 SSP N/A N/A N/A N/A N/A 1-100 Ge (100) 50.8 4000 SSP N/A N/A N/A N/A N/A 1-100 Ge (111)/(110) 50.8 200000 N/A 5-20 N/A N/A N/A N/A 1-100 Ge (100) 50.8 400 SSP <0.4 N/A N/A N/A N/A 1-100 Ge (100)/(111) 50.8 4000±10 DSP N/A N/A N/A N/A N/A 1-100 Ge (100) 50.8 350 SSP 1-10 P/Ga (110) ≤5000 N/A 1-100 Ge (100) 50.8 500±25 SSP 2-10 P/Ga (110) ≤5000 N/A 1-100 Ge (100) 50.8 500±25 SSP 0.3-3 N/Sb (110) ≤5000 N/A 1-100 Ge (100) 50.8 500±25 SSP 0.3-3 P/Ga (110) ≤5000 N/A 1-100 Ge (111) 60 1000 As cut >30 N/A (110) <3000 N/A 1-100 Ge (100) 100 N/A SSP <0.019 P/Ga (110) <500 N/A 1-100 Ge (100) 100 1000±25 SSP ≥30 N/undoped N/A N/A N/A 1-100 Ge (100) off 6°or off 9° 100 500 SSP 0.01-0.05 P/Ga N/A N/A N/A 1-100 Ge (100) 100 500 SSP 0.01-0.05 P/Ga N/A N/A N/A 1-100 Ge (100) 100 500 DSP 0.01-0.05 P/Ga N/A N/A N/A 1-100 Ge (100) 100 500 SSP <0.01 P/Ga N/A N/A N/A 1-100 Ge (100) 100 500 DSP <0.01 P/Ga N/A N/A N/A 1-100 Ge (100) 100 500 SSP ≥35 P/Ga N/A N/A N/A 1-100 Ge (100) 100 500 DSP ≥35 P/Ga N/A N/A N/A 1-100 Ge (100) 100 500 SSP 0.1-0.05 P/Ga N/A N/A <5A 1-100 Ge (100) 100 500 DSP 0.1-0.05 P/Ga N/A N/A <5A 1-100 Ge (100)6°off (111) 100 185±15 DSP 0.01-0.05 N/A (110) ≤5000 <5A 1-100 Ge (100)6°off (110) 100 525±25 SSP 0.01-0.04 N/A N/A N/A N/A 1-100 Ge (100) 100 N/A N/A N/A N/A N/A N/A N/A 1-100 Ge (100) 100 1000±15 SSP ≥30 N/A (110) ≤5000 N/A 1-100 Ge (100) 100 750±25 SSP ≥30 N/A (110) ≤5000 N/A 1-100 Ge (100) 100 500±25 SSP 10-30 N/A N/A N/A N/A 1-100 Ge (100)/(111) 100 160 DSP 0.05-0.1 P/Ga N/A <500 N/A 1-100 Ge (100)/(111) 100 160 DSP 0.05-0.1 P/Ga N/A <4000 N/A 1-100 Ge (100)/(111) 100 160 DSP 0.05-0.1 N/Sb N/A <500 N/A 1-100 Ge (100)/(111) 100 160 DSP 0.05-0.1 N/Sb N/A <4000 N/A 1-100 Ge (100)/(111) 100 190 DSP 0.05-0.1 P/Ga N/A <500 N/A 1-100 Ge (100)/(111) 100 190 DSP 0.05-0.1 P/Ga N/A <4000 N/A 1-100 Ge (111) 100 500±25 SSP <0.4 N/Sb N/A N/A N/A 1-100 Ge (100)6°off-cut toward(111)A 100 175±25 SSP 0.003-0.009 P/Ga (0-1-1) (0-11) <100 N/A 1-100 Ge (310)±0.1° 100 200±15 DSP >20 N/A N/A N/A N/A 1-100 Ge (111) 150 600-700 N/A >30 N/A (110) N/A N/A As a Ge wafer supplier,we offer germanium wafer list for your reference, if you need price detail, please contact our sales team Note: *** As manufacturer, we also accept small quantity for researcher or foundry. ***Delivery time: [...]

Indium Semiconductor Wafer

PAM-XIAMEN offers Indium Semiconductor Wafer:InAs,InP, InSb InAs wafer Substrate- Indium Arsenide Quantity Material Orientation. Diameter Thickness Polish Resistivity Type  Dopant Nc Mobility EPD PCS (mm) (μm) Ω·cm a/cm3 cm2/Vs /cm2 1-100 InAs (110) 40.0 500 SSP N/A P (1-9)E17 N/A N/A 1-100 InAs (100) 50.8 450 SSP N/A P 1E17/cc N/A < 20000 1-100 InAs (100) 50.8 400 SSP N/A N/S 5E18-2E19 >6,000 <1E4 1-100 InAs (100) 50.8 400 DSP N/A N/S 5E18-2E19 >6,000 <1E4 1-100 InAs (111)B 50.8 N/A SSP N/A N/S (1-3)E18 N/A N/A 1-100 InAs (100) 50.8 N/A SSP N/A N/Te 1E16/cc N/A N/A 1-100 InAs (100) 50.8 400 DSP N/A P (1-9)E18/cc N/A N/A 1-100 InAs (100) 3x3x5 N/A N/A N/A N/A 3E16/cc N/A N/A As a InAs wafer supplier,we offer InAs wafer list for your reference, if you need price detail, please contact our sales team 3)2”InAs Type/Dopant:N Un-doped Orientation : <111>A ±0.5° Thickness:500um±25um epi-ready Ra<=0.5nm Carrier Concentration(cm-3):1E16~3E16 Mobility(cm -2 ):>20000 EPD(cm -2 ):<15000 SSP 5)2”InAs Type/Dopant:N/P Orientation :(100), Carrier Concentration(cm-3):(5-10)E17, Thickness:500 um SSP Note: *** As manufacturer, we also accept small quantity for researcher or foundry. ***Delivery time: it depends on stock we have, if we have stock, we can ship to you soon. InP Wafer Substrate- Indium Phosphide Quantity Material Orientation. Diameter Thickness Polish Resistivity Type [...]