semico

Determining the optimal probing lot size for the wafer probe operation in semiconductor manufacturing

In this study, we reformulated the problem of wafer probe operation in semiconductor manufacturing to consider a probe machine (PM) which has a discrete Weibull shift distribution with a nondecreasing failure rate. To maintain the imperfect PM during the probing of a lot of wafers, a minimal repair policy is...

Computer modeling of surface interactions and contaminant transport in microstructures during the rinsing of patterned semiconductor wafers

Computer modeling of surface interactions and contamin Highlights • Dynamics of contaminant removal from the surface of micro/nanotrench is simulated. • The trench is rectangular and made of one or two different materials. • Various diffusivities and surface characteristics are considered in the model. • In multimaterial trench, cleaning dynamics strongly...