12″ Test Grade Silicon Wafer
PAM-XIAMEN offers 300mm bare silicon wafers (12 inch) dummy, test grade, n type or p type. Compared to other silicon wafer suppliers, Powerway Wafer offers professional service with competitive prices.
- Description
Product Description
PAM-XIAMEN offers 300mm P type or N type test silicon wafer (12 inch). The silicon test wafer thickness is 775±25μm. Compared to other silicon wafer suppliers, Powerway Wafer offers professional service with competitive prices.
1. Specification of Test Silicon Wafer
| Parameters | Value |
| Type of ingot | Grown according to the Czochralski method |
| Diameter, mm | 300 ± 0,2 |
| Dopant | B (boron) |
| Conductivity type | P |
| Oxigen max, OLD-PPMA | 40 |
| Carbon , PPMA | 1 |
| Test silicon wafer crystal orientation | <100> |
| Deviation from the predetermined surface orientation of crystal plane, deg | 1 |
| Volume resistivity, Ohm · cm | 10-40 |
| Primary Notch | Yes |
| Notch Location | 110 |
| Notch size, mm | 2,3 |
| Notch Form | V |
| Wafer thickness, microns | 775±25 |
| Type of marking | Laser |
| Silicon Laser Marking Location | Back side |
| Edge profile | by SEMI T/4 |
| Scratches on the front side | absent |
| Front side polishing | yes |
| Back side polishing | yes |
| Total change in wafer thickness (TTV), micrometers | 5 |
| Deflection (WARP), microns | 60 |
| The number of particles on a surface larger than 0.09 microns | 50 |
| Surface content of aluminium, E10AT/CM2 | 1 |
Packing requirements:
| Parameters | |
| Type of packaging | MW300GT-A |
| Inner Container Material | Polyethylene |
| Outer Packing Material | Aluminum |
| Number of pieces in one package | 25 |
| Reusability | yes |
2. Test Silicon Wafer Usage
Silicon wafers larger than 150mm are classified into Mechanical(dummy) Test Wafers and Process Test Wafers, and the test silicon wafer industry standards are in the following SEMI Standards（Semiconductor Equipment and Materials International, a global semiconductor association offered equipment, materials and service for manufacture of the worldwide semiconductor, photovoltaic (PV), LED, MEMS and flat panel display (FPD),and micro or nano-technologies）.
3. About Silicon Wafer Test Grade
However, different application has required different parameters for mechanical or process test wafer:
Process Test Grade Silicon Wafers
Process Silicon Wafer Test Grade, is called Monitor wafer, which is for process monitoring and some processing applications in wafer fabrication. Wafer fab also use monitor test wafers to assess equipment cleanliness, support particle measurement or evaluate metallic contamination etc
Dummy Silicon Wafer
Dummy Silicon Wafer, also called Mechanical grade test wafer, is to test equipment for wafer dimensional and structural characteristics only, which is used to do equipment automation handling tests, reliability marathons, and software tests, and assess interoperability performance of wafer handling hardware.
Also silicon wafer fab use mechanical grade silicon test wafers to process development applications that are not sensitive for particle and defects.
Test Particle Grade Silicon Wafers
Test Particle Grade Silicon Wafers is for particle test monitors to measure wafer particle when application.
According to SEMI standard, Particle of silicon wafer must be < 0.6 [email protected]>0.125μm/cm2 and < 0.15 [email protected]>0.25μm/cm2 for 250nm process and 130nm Design Rule Usage, 300mm wafers must have ≤60 [email protected]>=90nm for 130nm process.
Silicon Wafers for Photolithography or Patterning Test
Test Silicon Wafers for Photolithography or Patterning Test mainly focus on requirement in wafer thickness variation, TTV, WARP, BOW and flatness. For instant, a 250nm wafer die Design, its corresponding SEMI Standard M24: Flatness per Site (SFSR) of ≤ 0.2μm at site size 25 x 25mm.
Furnace Grade Test Silicon Wafers
Furnace Grade Test Wafer Semiconductor has strictly requirement for electrical characteristics but not tight particle performance.
Resistivity of Furnace grade test silicon wafer should be above 1ohm.cm and doped very evenly with lifetime>=200us.
Also furnace grade wafers is strictly controlled oxygen and carbon content, as well as radial resistivity gradient.
Virgin Test Wafers
Virgin test silicon wafers are not used in semiconductor manufacturing, but for wafer process monitoring according to SEMI M8-93.
Solar Grade Silicon Wafer
Compared with IC grade silicon wafer, Solar Grade silicon wafer has lower requirement,
its purity is >=99.9999% while purity in IC grade is >=99999999,99%
4. FAQ:
Q: What is the Difference between Prime, Test and Dummy Silicon Wafer?
A: Prime grade silicon wafer is the best grade silicon wafer for formal wafer manufacturing and photolithography.
Test silicon wafer is the silicon wafer for equipment test or fab management and test.
Dummy grade silicon wafer is the silicon wafer for production process evaluation, or safety measure in production line.
Compared with Test grade silicon wafer, the parameters of dummy grade silicon wafer is much easier or loose for testing equipment for wafer dimensional and structural characteristics only. But it is not so strict to distinguish sometimes.
PAM-XIAMEN can offer you technology and wafer support.
For more information, please visit our website: https://www.powerwaywafer.com/silicon-wafer,
send us email at [email protected] and [email protected]
Related Products
-
Cz Mono-Crystalline Silicon
PAM-XIAMEN, a monocrystalline bulk silicon producer, can offer <100>, <110> and <111> monocrystalline silicon wafers with N&P dopant in 76.2~200 mm, which are grown by CZ method. The Czochralski method is a crystal growth method, referred to as the CZ method. It is integrated in a straight-tube heat system, heated by graphite resistance, melts the polysilicon contained in a high-purity quartz crucible, and then inserts the seed crystal into the surface of the melt for welding. After that, the rotating seed crystal is lowered and melted. The body is infiltrated and touched, gradually raised, and finished or pulled through the steps of necking, necking, shouldering, equal diameter control, and finishing.
-
Epitaxial Silicon Wafer
Silicon Epitaxial Wafer(Epi Wafer) is a layer of epitaxial silicon single crystal deposited onto a single crystal silicon wafer(note: it is available to grow a layer of poly crystalline Silicon layer on top of a highly doped Singly crystalline silicon wafer, but it needs buffer layer (such as oxide or poly-Si) in between the bulk Si substrate and the top epitaxial silicon layer. It also can be used for thin film transistor.
-
Polished Wafer
PAM-XIAMEN can offer polished wafer, n type or p type with orientation at <100>, <110> or <111>. FZ polished wafers, mainly for the production of silicon rectifier (SR), silicon controlled rectifier (SCR), Giant Transistor (GTR), thyristor (GRO)
-
12″ Prime Grade Silicon Wafer
PAM-XIAMEN offer 300mm bare silicon wafers (12 inch) in prime grade, n type or p type, and the 300mm silicon wafer thickness is 775±15. Compared to other silicon wafer suppliers, Powerway Wafer’s silicon wafer price is more competitive with higher quality. 300mm silicon wafers have a higher yield per wafer than pervious large diameter silicon wafers.
-
12″ Silicon Wafers 300mm TOX ( Si Thermal Oxidation Wafer )
PAM-XIAMEN offers 300mm silicon oxide wafer and dioxide wafer. Thermal oxide silicon wafer or silicon dioxide wafer is a bare silicon wafer with oxide layer grown by dry or wet oxidation process. The thermal oxide layer of the silicon wafer is usually grown in a horizontal tube furnace, and the silicon wafer oxide temperature range is generally 900 ℃ ~ 1200 ℃. Compared with CVD oxide layer, silicon wafer oxide layer has higher uniformity, better compactness, higher dielectric strength and better quality.
-
Etching Wafer
The etching silicon wafers offered by PAM-XIAMEN are N type or P type etching wafers, which have low roughness, low reflectivity and high reflectivity. The etching wafer has the characteristics of low roughness, good glossiness and relatively low cost, and directly substitutes the polished wafer or epitaxial wafer which has relatively high cost to produce the electronic elements in some fields, reducing the costs.
-
Float-Zone Mono-Crystalline Silicon
PAM-XIAMEN can offer float zone silicon wafer, which is obtained by Float Zone method. Monocrystalline silicon rods is got through float zone growth, and then process the monocrystalline silicon rods into silicon wafers, called float zone silicon wafers. Since the zone-melted silicon wafer is not in contact with the quartz crucible during the floating zone silicon process, the silicon material is in a suspended state. Thereby, it is less polluted during the process of floating zone melting of silicon. The carbon content and oxygen content are lower, the impurities are less, and the resistivity is higher. It is suitable for the manufacture of power devices and certain high-voltage electronic devices.
-
Test Wafer Monitor Wafer Dummy Wafer
As a dummy wafer manufacturer, PAM-XIAMEN offers silicone dummy wafer / test wafer / monitor wafer, which is used in a production device to improve safety in the beginning of production process and are used for delivery check and evaluation of process form. As dummy silicon wafers are often used for experiment and test, size and thickness thereof are important factors in most occasions. 100mm, 150mm, 200mm, or 300mm dummy wafer is available.
