Test Wafer Monitor Wafer Dummy Wafer

Test Wafer Monitor Wafer Dummy Wafer

As a dummy wafer manufacturer, PAM-XIAMEN offers silicone dummy wafer / test wafer / monitor wafer, which is used in a production device to improve safety in the beginning of production process and are used for delivery check and evaluation of process form. As dummy silicon wafers are often used for experiment and test, size and thickness thereof are important factors in most occasions. 100mm, 150mm, 200mm, or 300mm dummy wafer is available.

  • Description

Product Description

Test Wafer Monitor Wafer Dummy Wafer

As a dummy wafer manufacturer, PAM-XIAMEN offers silicone dummy wafer / test wafer / monitor wafer, which is used in a production device to improve safety in the beginning of production process and are used for delivery check and evaluation of process form. As dummy silicon wafers are often used for experiment and test, size and thickness thereof are important factors in most occasions. 100mm, 150mm, 200mm, or 300mm dummy wafer is available.

 

1. Test Wafer List

1.1 Single Side Polished Test Wafer N Type (200Nos)

Sl No  Item  SCL SPECIFICATIONS
1 Growing method CZ
2 Wafer Diameter 150 ± 0.5mm
3 Wafer Thickness 675±25 µm
4 Wafer Surface Orientation <100>±2°
5 Dopant Phosphorus
6 Dislocation Density Less than 5000/cm2
8 Resistivity 4-7Ωcm
9 Radial Resistivity Variation (max.) 15%
10 Flatness  
10a ·         BOW (max.) 60 µm
10b ·         TIR (max.) 6 µm
10c ·         TAPER (max.) 12 µm
10d ·         WARP (max.) 60 µm
11 Primary Flat  
11a ·         Length 57.5±2.5 mm
11b ·         Orientation {110}±2° as per SEMI Standard
11c Secondary Flat As per SEMI Standard
12 Front Surface Finish Mirror Polished
13 Max. particles of size ≥0.3µm 30
14 ·         Scratches, Haze, Edge Chips, Orange Peel & Other defects Nil
15 Back Surface Damage free Etched
16 Packing Requirement Should be vacuum sealed in Class ’10’environment in double layer packing.Wafers should be shipped in Fluorware ORION TWO wafer shippers or equivalent make made from ultra clean polypropylene

 

1.2 Double Side Polished Test Wafer N Type (150 Nos)

Sl No Item SCL SPECIFICATIONS
1 Growing method CZ
2 Wafer Diameter 150 ± 0.5mm
3 Wafer Thickness 675±25µm
4 Wafer Surface Orientation <100>±2°
5 Dopant Phosphorus
6 Dislocation Density Less than 5000/cm2
8 Resistivity 4-7Ωcm
9 Radial Resistivity Variation (max.) 15%
10 Flatness  
10a ·         BOW (max.) 60 µm
10b ·         TIR (max.) 6 µm
10c ·         TAPER (max.) 12 µm
10d ·         WARP (max.) 60 µm
11 Primary Flat  
11a ·         Length 57.5±2.5 mm
11b ·         Orientation {110}±2° as per SEMI Standard
11c Secondary Flat As per SEMI Standard
12 Front Surface Finish Mirror Polished
13 Max. particles of size ≥0.3µm 30
14 ·         Scratches, Haze, Edge Chips, Nil
Orange Peel & Other defects
15 Back Surface Mirror Polished
16 Packing Requirement Should be vacuum sealed in Class ’10’
environment in double layer packing.
Wafers should be shipped in Fluorware
ORION TWO wafer shippers or equivalent
make made from ultra clean polypropylene

 

1.3 Monitor Wafer / Dummy Wafer

Monitor / Dummy Silicon wafer

Wafer Diameter Polished Wafer Surface Wafer Thickness Resistivity Particle
Orientation
4″ 1 side 100/111 250-500μm 0-100 0.2μm≤qty30
6″ 1 side 100 500-675μm 0-100 0.2μm≤qty30
8″ 1 side 100 600-750μm 0-100 0.2μm≤qty30
12″ 2 side 100 650-775μm 0-100 0.09μm≤qty100

 

1.4 REGENERATED 200mm WAFERS

Item# PARAMETER Units Value Notes
1 Growth Method   CZ  
2 Orientation   1-0-0  
3 Resistivity Ωм.см 1-50  
4 Type / dopant   р,n/  
Boron, Phosphorus
5 Thickness мкм 1гр. – 620,  
2гр. – 650
3гр. – 680
4гр. – 700
5гр. – 720
6 GBIR (TTV мкм 1-3гр. <30,  
4-5гр. <20
7 GLFR (TIR мкм <10  
8 Warp мкм <60  
9 Bow мкм <40  
10 Metal contamination 1/см2 <3E10  
11 Front surface   Polished  
12 Front surface visual:      
Haze, Scratches, Stains, Spots   none
Orange Peel   none
Cracks, Craters   none
13 Front Side LPD:     Number of wafers with stated parameter value should be not less than 80% of batch,
< 0,12мкм   <100
<0,16мкм   <50
<0,20мкм   <20
<0,30мкм   <10

2. Dummy Wafer Definition

Dummy wafer (also called as test wafers) is a Si dummy wafer mainly used for experiment and test and being different from general wafers for product. Accordingly, reclaimed wafers are mostly applied as dummy grade wafers (test wafers).

In each process, film thickness, pressure resistance, reflection index and presence of pinball are measured using dummy Si wafer(test wafer). Also, dummy wafers (test wafers) are used for measurement of pattern size, check of defect and so on in lithography.

Monitor wafers are the wafers to be used in the case that an adjustment is required in each production step prior to the actual IC production. For example, when the conditions of each process are set, such as the case of measuring tolerance of device against ( the variation of ) substrate thickness, monitor wafers are being used as a substitution of high-standard and high value wafers. Moreover, they are also used for the monitoring purpose in the process together with product wafers. Monitor wafers are necessary wafer materials as important as product prime wafers. They are also called as test wafers together with dummy wafers.

For more product detail or if you have required specification, please contact us at [email protected] or [email protected]

Test grade silicon wafers-1

Test grade silicon wafers-2

Test grade silicon wafers-3

Test grade silicon wafers-4

Test grade silicon wafers-5

Test grade silicon wafers-6

Test grade silicon wafers-7

Test grade silicon wafers-8

Test grade silicon wafers-9

Test grade silicon wafers-10

Test grade silicon wafers-11

8″ Dummy Grade Silicon Wafer

12″ Dummy Grade Silicon Wafer Thickness 700-730um

12″ Dummy Grade Silicon Wafer Thickness 650-700um

12″ Test Grade Silicon Wafer

4″ Test Grade Silicon Wafers with Single Side Polished

12”Dummy wafer

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