PAM XIAMEN offers Glass Substrates(BK7 Glass and Corning Glass).

BK7 Glass

BK 7 (Schott) glass substrates 76.2mm x 25.4 mm x 0.5 mm, Double sides optical polished
BK7 (Schott) glass substrates 10 x10 x 0.5 mm, Double sides polished ( 60/40)
BK7 (Schott) glass substrates 25.4mm x 25.4 mm x 0.5 mm, Surface Quality:( 60/40)

Corning Glass

Borofloat ( Corning Pyrex 7740 Equvilent Glass ) 76mm x 25 mm x 1.0 mm, Double sides optical polished<60/40>
Borofloat ( Corning Pyrex 7740 Equvilent Glass ) Substrates 100mm x 100 mm x 1.0 mm, Double sides optical polished<60/40>
Corning EAGLE XG Glass Substrates 10 mm x 10 mm x 0.7 mm
Corning EAGLE XG Glass Substrates 100mm x 100 mm x 0.7 mm
Corning EAGLE XG Glass Substrates 25 mm x 75mm x 0.7 mm,( 10 pcs /pack)
Corning EAGLE XG Glass Substrates 25.4 mm x 25.4 mm x 0.7 mm,( 10 pcs /pack)
Corning EAGLE XG Glass Substrates 25.4 mm x 25.4 mm x 1.1 mm,( 10 pcs /pack)
Corning EAGLE XG Glass Substrates 25.4 mm x 76.2 mm x 1.1 mm,( 10 pcs /pack)
Corning EAGLE XG wafer 100.0 mm dia x 0.7 mm, 2 sp surface quality 60/40
Corning EAGLE XG wafer 100mm dia x 0.5mm, 2 sp surface quality 60/40
Corning EAGLE XG wafer 150mm dia x 0.7 mm, 2 sp surface quality 60/40
Corning EAGLE XG wafer 150mm dia x 1.1 mm, 2 sp surface quality 60/40
Corning EAGLE XG wafer 25.0 mm dia x 0.5mm, 2 sp surface quality 60/40
Corning EAGLE XG wafer 50.8mm dia x 0.5mm, 2 sp surface quality 60/40
Corning EAGLE XG wafer 76.2mm dia x 0.5mm, 2 sp surface quality 60/40
Corning Willow Glass 100mm dia x 0.2mm, 2 sp surface quality 60/40
Corning Willow Glass 100mm x100mm x 0.2mm, 2 sp surface quality 80/50
Corning Willow Glass 152.4mm x152.4mm x 0.1mm, 2 sp surface quality 80/50
Corning Willow Glass 152.4mm x152.4mm x 0.2mm, 2 sp surface quality 80/50

For more information, please visit our website: https://www.powerwaywafer.com,
send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com

Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China. PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices. PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.

PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, range from the first generation Germanium wafer, second generation Gallium Arsenide with substrate growth and epitaxy on III-V silicon doped n-type semiconductor materials based on Ga, Al, In, As and P grown by MBE or MOCVD, to the third generation: Silicon carbide and Gallium Nitride for LED and power device application.