Highlights
•MOCVD growth of a p-GaN/i-InGaN/n-GaN (PIN) solar cell on ZnO/Sapphire templates.
•In-depth structural characterizations showing no back-etching of ZnO.
•Chemical lift-off and wafer-bonding of the structure on float glass.
•Structural characterizations of the device on glass.
Abstract
p-GaN/i-InGaN/n-GaN (PIN) structures were grown epitaxially on ZnO-buffered c-sapphire substrates by metal [...]
PAM XIAMEN offers6″ FZ Silicon Wafer-5
Silicon wafers, per SEMI Prime, P/E 6″Ø×875±25µm,
FZ p-type Si:B[111]±0.5°, Ro > 10,000 Ohmcm,
Warp<60μm,
One-side-polished, Particles: ≤10@≥0.3μm,
MCL (Na, Al, K, Fe, Ni, Cu, Zn)<5E10/cm²,back-side etched,
Tarnish, orange peel, contamination, haze,
micro scratch, chips, edge chips, crack,
crow feet, pin hole, pits, dent, waviness,
smudge&scar on [...]
2019-09-19meta-author
PAM XIAMEN offers 4″ Silicon Wafer.
Material
Orient.
Diam.
Thck
(μm)
Surf.
Resistivity
Ωcm
Comment
n-type Si:P
[100]
4″
525
P/E
FZ 4,200-8,000
SEMI TEST (Bad Surface & Chips), Lifetime>1,400μs, in Empak cassettes of 7 & 7 wafers
n-type Si:P
[100] ±0.2°
4″
380 ±10
P/E
FZ >3,500
SEMI TEST , 1 Flat
n-type Si:P
[100]
4″
400 ±10
P/P
FZ 3,100-6,800
SEMI Prime, TTV<5μm
n-type Si:P
[100]
4″
200
P/P
FZ >3,000
SEMI Prime, MCC Lifetime > 1,000μs,
n-type Si:P
[100]
4″
400
P/E
FZ 2,000-6,500
SEMI Prime, Lifetime>1,000μs
n-type Si:P
[100]
4″
915 ±10
E/E
FZ 2,000-3,000
1Flat at [100]
n-type Si:P
[100]
4″
300
L/L
FZ 1,100-1,600
SEMI
n-type Si:P
[100] ±1°
4″
200 [...]
2019-03-05meta-author
PAM XIAMEN offers Silver(Ag) on Si wafer .
Silver Film on Silicom Wafer ,Ag: 0.2 microns / ,Si(100) P-type R:1-20 ohm.cm
Silver Metallic Film
Film Deposition by DC Sputtering
Silver Thickness: 0.2 microns
Film Resistivity: N/A
Film Crystallinity: N/A
Roughness, RMS: 4.87 nm and < [...]
2019-04-29meta-author
CONGRESSIONAL RESEARCH ARM PRODUCES REPORT ON THE U.S. CHIP INDUSTRY
A newly released report by a non-partisan research arm of Congress underscores how semiconductors’ economic and military importance has made the industry’s health a focus of congressional interest for nearly 70 years. The report, produced by the [...]
2016-07-20meta-author
PAM XIAMEN offers 8″ Silicon Wafer
8″ Silicon Wafer
P-Type
Diameter 200.00±0.5 mm
Thickness 725±50μm
Dislocation density < 10-2 cm-2
Dopant – Boron
Resistivity- 10-40 Ω.cm
Chamfer width 700-1000 μm
Orientation – (100)±0.5
single sided polishing
For more information, please visit our website: https://www.powerwaywafer.com,
send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com
Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is [...]
2019-09-03meta-author