PAM XIAMEN offers 3″ Silicon Wafer.
Material
Orient.
Diam.
Thck
(μm)
Surf.
Resistivity
Ωcm
Comment
Si
3″
P/P
SEMI TEST (Unsealed)t
Si
3″
P/P
SEMI TEST (Unsealed)t
n-type Si:P
[100] ±0.1°
3″
380
P/E
FZ >5,000
SEMI Test, Bad Lasermark on back. To use with chuck light polish needed on back
n-type Si:P
[100]
3″
381
P/P
FZ 100-500
SEMI Prime
n-type Si:P
[111]
3″
300
P/E
FZ 61-95
Prime, NO Flatst
Intrinsic Si:-
[100]
3″
300
P/P
FZ >20,000
Prime, NO Flats, Individual cst
Intrinsic Si:-
[111] ±0.5°
3″
1975
P/P
FZ >20,000
Prime, NO Flats, Individual cst
p-type Si:B
[110]
3″
380
P/E
1-10
1 F @ <1,-1,0>
p-type Si:B
[100]
3″
380
P/P
80-170
SEMI Prime
p-type Si:B
[100]
3″
300
P/P
30-35
SEMI Prime
p-type Si:B
[100]
3″
200
P/E
10-20
SEMI [...]
2019-03-06meta-author
GaN Substrates Offer High Performance At A Price
GaN substrates are manufactured by only a handful of companies at prices prohibitive to volume production, but offer great potential for high-performance devices. Richard Stevenson reports.The GaN component market was worth $1.35 billion in 2003 according to [...]
2013-03-21meta-author
PAM XIAMEN offers test grade silicon wafers
Below is just a short list of the test grade silicon substrates!
Inches
Cust class
Dopant
Type
Orientation
PFL length
PFL direction
SFL
Off orientation
Resistivity
Diameter
Thickness
Bow
TTV
Warp
4
DSP
Boron
P
100
32,5 ± 2,5
110 ± 1
0.0 ± 1.0°
1 – 100 Ohmcm
100 ± 0.3 mm
302 ± 4 µm
35
4
35
4
DSP
Boron
P
100
32,5 ± 2,5
110 ± 0,50
90 ± 5.0 °, [...]
2019-02-25meta-author
PAM XIAMEN offers Cu Coated Silicon.
Cu Film on Silicon Wafer, 4″ , 400 nm Thick, – Cu-Ti on Si-4-400nm
Cu Film on Ta/Silicon Wafer, 4″ , 100 nm Thick, – Cu-Ta-Si-4-100nm
Cu Film on Ta/thermal oxide/Silicon Wafer, 4″ , 400 nm Thick, – [...]
2019-04-26meta-author
Thinking thin brings new layering and thermal abilities to the semiconductor industry
This image shows a thick bulk gallium nitride (GaN) crystal wafer (2 inches in diameter) with a GaN film in the foreground fabricated by controlled spalling (its film thickness is ~20 microns or [...]
2017-07-26meta-author
A test report is necessary to show the compliance between custom description and our final wafers data. We will test the wafer characerization by equipment before shipment, testing surface roughness by atomic force microscope, type by Roman spectra instrument, resistivity by non-contact resistivity testing [...]
2018-08-14meta-author