PAM XIAMEN offers 4″FZ Prime Silicon Wafer-9
4″ Silicon Wafer
Orientation (100)
Thickness 525±25μm
SSP
P type, Boron doped
Resistivity>200Ωcm
Roughness<8 Angstrom
For more information, send us email at [email protected] and [email protected]
4″ Silicon Wafer
Orientation (100)
Thickness 525±25μm
SSP
P type, Boron doped
Resistivity>200Ωcm
Roughness<8 Angstrom
For more information, send us email at [email protected] and [email protected]
PAM XIAMEN offers 4″ Silicon Wafer. Material Orient. Diam. Thck (μm) Surf. Resistivity Ωcm Comment Intrinsic Si:- [100] 4″ 500 P/E FZ 13,000-20,000 SEMI Prime, TTV<5μm, Front-side Prime polish, Back-side light polish Intrinsic Si:- [100] 4″ 615 ±10 C/C FZ >10,000 SEMI Prime Intrinsic Si:- [100] 4″ 800 C/C FZ >10,000 SEMI Prime Intrinsic Si:- [111] ±0.5° 4″ 525 P/E FZ >22,000 SEMI Prime Intrinsic Si:- [111] ±0.5° 4″ 300 P/E FZ 20,000-40,000 SEMI, TTV<5μm Intrinsic Si:- [111] ±0.5° 4″ 450 P/P FZ >20,000 SEMI Prime Intrinsic Si:- [111] ±0.5° 4″ 500 P/E FZ >20,000 SEMI Prime, Extra 3 free non-prime wafers included with 4 prime wafers Intrinsic Si:- [111] ±1.0° 4″ 500 P/P FZ >15,000 SEMI Prime, TTV<5μm p-type Si:B [110] ±0.25° 4″ 525 P/E 5-10 SEMI [...]
PAM XIAMEN offers Si wafer Thickness: 675 ± 25 um. Si wafer Method: Cz Orientation: <111> Type: P-Type Dopant: Boron Resistivity: 0.1-13 ohm.cm Diameter: 150 ± 0.1 mm Thickness: 675 ± 25 um Chamfer Front side: Epi-ready Back side: etched BOW < 30um Warp [...]
Single-emitter LD Chip 9xxnm @15W PAM200914-LD-CHIP-976nm Brand: PAM-XIAMEN Wavelength: 9xxnm Stripe width: 96um Output Power: 15W Cavity Length:4mm For more information, please contact us email at [email protected] and [email protected]
Through continuous efforts, PAM-XIAMEN has developed large-scale COP-free CZ silicon (Si) wafers, and effectively controlled the generation of COP in the ingot by improving the thermal field of crystal pulling, thereby achieving performance improvement and power consumption reduction. The 8-inch silicon wafer application process [...]
GaN epi layers are usually grown by MOCVD on various substrates, such as sapphire, Si and SiC substrate. The choice of substrate varies according to the needs of the applications. So for RF MOSFET (Metal Oxide Semiconductor Field Effect Transistor) application, SiC substrate, which [...]
Xiamen Powerway Advanced Material Co.,Ltd., a leading supplier of AlGaAs layer and other related products and services announced the new availability of size 2”-3” is on mass production in 2017. This new product represents a natural addition to PAM-XIAMEN’s product line. Dr. Shaka, said, “We [...]