As a semiconductor wafer supplier, silicon wafers by FZ or CZ are provided at prime grade, test grade and so on. More wafer specifications, please view https://www.powerwaywafer.com/silicon-wafer. The post-processing of the silicon crystal from PAM-XIAMEN is introduced below.
After the silicon crystal is grown, the [...]
2022-07-11meta-author
After the growth, the silicon carbide single crystal is crystal ingot with surface defects, which cannot be directly used for epitaxy. Therefore, it requires chemical mechanical polishing on silicon carbide. Among the processing skills, spheronization makes the crystal ingot into a standard cylinder; wire [...]
2021-04-02meta-author
A comparative study of the bonding energy in adhesive wafer bonding
Adhesion energies are determined for three different polymers currently used in adhesive wafer bonding of silicon wafers. The adhesion energies of the polymer off-stoichiometry thiol-ene-epoxy OSTE+ and the nano-imprint resist mr-I 9150XP are determined. [...]
2018-07-17meta-author
Xiamen Powerway Advanced Material Co.,Ltd., a leading supplier of GaN and other related products and services announced the new availability of size 2” is on mass production in 2017. This new product represents a natural addition to PAM-XIAMEN’s product line.
Dr. Shaka, said, “We are pleased to [...]
2017-11-15meta-author
Effects of post-growth annealing on the performance of CdZnTe:In radiation detectors with different thickness
An effective post-growth annealing method was used to improve the performance of CdZnTe:In (CZT:In) radiation detectors. The results indicated that Te inclusions in CZT:In crystals with different thickness were eliminated completely [...]
PAM XIAMEN offers Ceramic ALN SUBSTRATE.
100X100 Thickness 0.5±0.03mm
Item
Unit
Value
Test Standard
1)Colour
—-
Gray
3.2
2)Density
g/cm³
≥3.33
GB/T 2413
3)Thermal Conductivity
20℃,W/(m·K)
≥170
GB/T 5598
4)Dielectric Constant
1MHz
8~10
GB/T 5594.4
5)Dielectric Strength
KV/mm
≥17
GB/T 5593
6)Flexural Strength
MPa
≥450
GB/T 5593
7)Camber
Length‰
≤2‰
8)Surface roughness Ra
μm
0.3~0.6
GB/T 6062
9)Water absorption
%
0
GB/T 3299-1996
10)Volume resistivity
20℃,Ω.cm
≥1013
GB/T 5594.5
11)Thermal expansivity
10-6/℃
20~300℃
2~3
GB/T5593
300~800℃
2.5~3.5
For more information, please visit our website: https://www.powerwaywafer.com,
send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com
Found in 1990, Xiamen [...]
2019-07-03meta-author