2-36.Reclaim Grade
Reclaim Grade:A lower quality wafer that has been used in manufacturing and then reclaimed , etched or polished, and then used a second time in manufacturing.
2-36.Reclaim Grade
Reclaim Grade:A lower quality wafer that has been used in manufacturing and then reclaimed , etched or polished, and then used a second time in manufacturing.
2-19.Scratches A scratch is dened as a singular cut or groove into the frontside wafer surface with a length-to-width ratio of greater than 5 to 1, and visible under hight intensity illumination.
2-3.Wafer Flat Length Linear dimension of the at measured with ANSI certied digital calipers on a sample of one wafer per ingot.
2-16.Pits Individual distinguishable surface anomalies, which appears as a depression in the wafer surface with a lengthto-width ratio less than 5 to 1, and visible under high intensity illumination.
Most analog signal conditioning and digital logic circuits are considered “signal level” in that individual transistors in these circuits do not typically require any more than a few milliamperes of current and <20 V to function properly. Commercially available silicon-on-insulator circuits can perform complex digital and [...]
5-2-2-1 SiC Crystallography: Important Polytypes and Definitions Silicon carbide occurs in many different crystal structures, called polytypes. A more comprehensive introduction to SiC crystallography and polytypism can be found in Reference 9. Despite the fact that all SiC polytypes chemically consist of 50% carbon atoms covalently bonded [...]
5-4-4-3 SiC Epilayer Doping In-situ doping during CVD epitaxial growth is primarily accomplished through the introduction of nitrogen (usually) for n-type and aluminum (usually trimethyl- or triethylaluminum) for p-type epilayers . Some alternative dopants such as phosphorus and boron have also been investigated for the [...]
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