5-6-4-1-2 Bipolar and Hybrid Power Rectifiers
For higher voltage applications, bipolar minority carrier charge injection (i.e., conductivity modulation) should enable SiC pn diodes to carry higher current densities than unipolar Schottky diodes whose drift regions conduct solely using dopant-atom majority carriers . Consistent with silicon [...]
2018-06-28meta-author
2-6.Wafer Primary Flat
The flat of longest length on the wafer, oriented such that the chord is parallel with a specified low index crystal plane; major flat.
The primary at is the {10-10} plane with the at face parallel to the <11-20> direction.
2018-06-28meta-author
5-2-1-2 Electrical Properties
Owing to the differing arrangement of Si and C atoms within the SiC crystal lattice, each SiC polytype
exhibits unique fundamental electrical and optical properties. Some of the more important semiconductor
electrical properties of the 3C, 4H, and 6H SiC polytypes are given in [...]
2018-06-28meta-author
5-6-2 SiC RF Devices
The main use of SiC RF devices appears to lie in high-frequency solid-state high-power amplification at frequencies from around 600 MHz (UHF-band) to perhaps as high as a few gigahertz (X-band). As discussed in far greater detail in References 5, 6, [...]
2018-06-28meta-author
5-6 SiC Electronic Devices and Circuits
This section briefly summarizes a variety of SiC electronic device designs broken down by major application areas. SiC process and material technology issues limiting the capabilities of various SiC device topologies are highlighted as key issues to be addressed [...]
2018-06-28meta-author
5-3 Applications and Benefits of SiC Electronics
Two of the most beneficial advantages that SiC-based electronics offer are in the areas of high-temperature
and high-power device operation. The specific SiC device physics that enables high-temperature and
high-power capabilities will be examined first, by several examples of revolutionary [...]
2018-06-28meta-author