PAM XIAMEN offers 1″ FZ Silicon Ingot with Diameter 25mm
Silicon ingot, per SEMI, G Ø25mm
FZ n-type Si:P[100]±2.0°,
Ro=(1,500-7,000)Ohmcm,
Ground Ingot, NO Flats,
MCC Lifetime>1000µs,
Oxygen<1E16/cc, Carbon<1E16/cc,
Adequately packed, CofC: present.
For more information, send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com
Silicon carbide of Ni/6H-SiC and Ti/4H-SiC type Schottky diode current-voltage characteristics modelling On the base of the physical analytical models based on Poisson’s equation, drift–diffusion and continuity equations the forward current–voltage characteristics of 6H-SiC and 4H-SiC type Schottky diode with Ni and Ti Schottky contact [...]
Sapphire Substrate Market in 2013 Will cell phone windows come to the rescue? Significant overcapacity and low LED substrate prices will affect the profitability and viability of many sapphire players in 2013 and beyond, but emerging applications could transform the industry. The sapphire material shortage experienced from [...]
PAM XIAMEN offers BK7 Glass for Precision Lenses. Below are just some of the BK7 Glass Windows. Please send us email at sales@powerwaywafer.com if you need other specs and quantity. Item Dia (mm) Thick (μm) Pol Qty in Stock PAM3334 76.2 500 DSP 100 PAM3335 100 500 DSP 100 PAM3336 150 500 DSP 100 For more information, please visit our website: https://www.powerwaywafer.com, send us email at sales@powerwaywafer.com and [...]
PAM XIAMEN offers 4″FZ Silicon Ignot. Silicon ingot, per SEMI, G 4″Ø (Diameter 100.5±0.3mm), FZ Intrinsic undoped Si:-[100]±0.5°, Ro > 20,000 Ohmcm, Ground Ingot, NO Flats. Lifetime>1,000us, Ox/Carbon <1E16/cc. For more information, please visit our website: https://www.powerwaywafer.com, send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com [...]
Slicing, cleaning and kerf analysis of germanium wafers machined by wire electrical discharge machining This paper investigates the slicing of germanium wafers from single crystal, gallium-doped ingots using wire electrical discharge machining. Wafers with a thickness of 350 μm and a diameter of 66 mm were cut [...]
