PAM XIAMEN offers 785nm laser diode wafers grown on GaAs substrate. Specific epi structure please see below:
1. Specifications of 785nm GaAs LD Epi Wafer
No.1 AlAs / AlGaAs LD Epi on GaAs PAM200420-LD
Layer
Material
Thickness
Notes
Layer 7
AlAs
–
Layer 6
GaAs
–
Layer 5
AlAs
–
Layer 4
AlGaAs
150 nm
Emitting at 785nm
Layer 3
AlAs
–
Layer 2
AlGaAs
–
Emitting at 700 nm
Layer [...]
2019-03-13meta-author
N-Type Silicon Substrates
PAM XIAMEN offers n-type silicon wafers in stock.
N-type Silicon
50.8mm N-type Arsenic Doped (100) 0.001-0.005 ohm-cm 280um SSP In stock
76.2mm N-type Phosphorous Doped (100) 1-10 ohm-cm 380um SSP In stock
100mm N-type Phosphorus Doped (100) 10-20 ohm-cm 280um DSP In stock
150mm N-type Antimony Doped [...]
2019-02-14meta-author
PAM-XIAMEN can offered SiC wafers, specific specifications and parameters can be found in: https://www.powerwaywafer.com/sic-wafer
4H-SiC single crystal has excellent characteristics such as wide bandgap, high carrier mobility, high thermal conductivity, and good stability. It has broad application prospects in high-power electronics, radio frequency/microwave electronics, and quantum information. [...]
2024-03-15meta-author
Silicon epitaxy with Boron dopant in size 200mm from PAM-XIAMEN is available for semiconductor device fabrication. Silicon epitaxy growth is a surface treatment process for silicon wafers, which means that a single crystal film is superimposed on the polished wafer by chemical reaction or other [...]
2021-06-08meta-author
PAM XIAMEN offers Si-Ge alloy crystal.
Si-Ge or silicon-germanium alloy wafer is commonly used as semiconductor material in integrated circuits (ICs) for heterojunction bipolar transistors or as a strain-inducing layer for CMOS transistors. Si-Ge alloys wafer are of interest because they have higher mobility [...]
2019-05-16meta-author
PAM XIAMEN offers Cleaving Silicon Wafer, which is cut by multi-wire cutting technology. Here is the cleaving silicon wafer specs:
Cleaving (100) silicon wafers
Cleaving (111) silicon wafers
Here comes a question: how to cleave a silicon wafer? At present, the silicon wafer cleaving technology mostly adopts the [...]
2019-02-22meta-author