PAM XIAMEN offers test grade silicon wafers
Below is just a short list of the test grade silicon substrates!
Inches
Cust class
Dopant
Type
Orientation
PFL length
PFL direction
SFL
Off orientation
Resistivity
Diameter
Thickness
Bow
TTV
Warp
6
SSP
Arsenic
N+
100
57,5 ± 2,5
110 ± 1
0.0 ± 1.0 °
0.0028-0.0035 Ohmcm
150 ± 0.5 mm
440 ± 20 µm
40
5
40
6
SSP
Arsenic
N+
111
57,5 ± 2,5
110 ± 1
4.0 ± 0.5 °
< 0.0035 Ohmcm
150 [...]
2019-02-25meta-author
Three decorative LED luminaires from Acuity Brands were selected to receive a 2016 Lighting for Tomorrow (LFT) award. The annual competition was created in 2002 to recognize the best decorative, energy-efficient luminaires in the market, and is organized by the American Lighting Association, the Consortium for Energy Efficiency [...]
2016-09-14meta-author
Lithium niobate (LiNbO3) wafer has excellent electro-optic, nonlinear and piezoelectric properties. With the advanced micro- and nanofabrication techniques, integrated photonics devices based on lithium niobate on insulator (LNOI) thin films have been extensively studied. In the future, high-performance LiNbO3 thin film prepared will support [...]
2020-03-10meta-author
PAM XIAMEN offers 3″ Silicon Wafer-17 as follows, while silicon wafer list includes, but not limited to the following.
Silicon wafers, per SEMI Prime,
P/P 4″Ø×300±25µm,
p-type Si:B[100]±0.5°, Ro=(5-10)Ohmcm,
TTV<10µm, Bow<40µm, Warp<40µm,
Both-sides-polished, SEMI Flats (two),
Primary Flat length 32.5±2.5mm, orientation 110±1°。
Secondary Flat length 18±2mm, orientation 90°±5°
Sealed in Empak cassette
For [...]
2019-11-26meta-author
PAM XIAMEN offers Silicon Ingots.
Material Description
FZ 4″Ø×105mm ground ingot, n-type Si:P[111] ±2°, (1-2)Ohmcm
FZ 4″Ø×374mm ground ingot, n-type Si:P[111] ±2°, (429.4-453.7)Ohmcm, MCC Lifetime=11,866µs
FZ 4″Ø×400mm ground ingot, n-type Si:P[111] (446.9-458.9)Ohmcm, MCC Lifetime=10,670µs
FZ 4″Ø ingot Intrinsic Si:-[100], Ro: >20,000 Ohmcm, MCC Lifetime>1,200μs, Ground, (6 ingots: 294mm, 296mm, 296mm, 294mm, 219mm, 112mm)
FZ 4″Ø ingot Intrinsic [...]
2019-03-08meta-author
Fabrication of GaN wafers for electronic and optoelectronic devices
The fabrication of GaN wafers from GaN boules (ingots) is described. Gallium nitride boules were grown by hydride vapor phase epitaxy and sliced and sized into wafer blanks. The GaN wafer blanks were lapped and polished. [...]