PAM-XIAMEN offers (20-21) Plane Si-GaN Freestanding GaN Substrate
Item
PAM-FS-GAN(20-21)-SI
Dimension
5 x 10 mm2 or 5 x 20 mm2
Thickness
380+/-50um
Orientation
(20-21)/(20-2-1) plane off angle toward A-axis 0 ±0.5°
(20-21)/(20-2-1) plane off angle toward C-axis -1 ±0.2°
Conduction Type
Semi-Insulating
Resistivity (300K)
> 106 Ω.cm
TTV
≤ 10 µm
BOW
BOW ≤ 10 µm
Surface Roughness:
Front side: Ra<0.2nm, epi-ready;
Back side: Fine Ground or polished.
Dislocation Density
≤5 x 106 cm-2
Macro Defect Density
0 cm-2
Useable Area
> 90% (edge exclusion)
Package
each in single wafer container, under nitrogen atmosphere, packed in class 100 clean room
For more information, please contact us email at victorchan@powerwaywafer.com and powerwaymaterial@gmail.com
2020-08-20meta-author
PAM XIAMEN offers DyScO3/GdScO3//TbScO3 crystal.
Crystal
Structure /Lattice Constant(A)
MP oC
Density, g/cm3
Growth Tech
DyScO3
Orthorombic a=5.44 b=5.71 c=7.89
2127
6.9
CZ
GdScO3
Orthorombic a=5.45 b=5.75 c=7.93
2127
6.6
CZ
TbScO3
Orthorhombic, a = 5.4543, b = 5.7233 c = 7.9147
2127
6.6
CZ
DyScO3 (110) 5x5x0.5mm 1sp (PAM210322-DYSCO3)
DyScO3 (110) 5x5x0.5mm 1sp”
DyScO3 (110) 5x5x0.5mm 2sp
DyScO3 (110) 10x10x0.5mm 1sp
DyScO3 (110) 10x10x0.5mm 2sp
DyScO3 (001) 10x10x0.5mm 1sp [...]
2019-05-20meta-author
PAM-XIAMEN offers M Plane Si-GaN Freestanding GaN Substrate
Item
PAM-FS-GAN M-SI
Dimension
5 x 10 mm2 or 5 x 20 mm2
Thickness
380+/-50um
Orientation
M plane (1-100) off angle toward A-axis 0 ±0.5°
M plane (1-100) off angle toward C-axis -1 ±0.2°
Conduction Type
Semi-Insulating
Resistivity (300K)
>106 Ω·cm
TTV
≤ 10 µm
BOW
BOW ≤ 10 µm
Surface Roughness
Front side: Ra<0.2nm, epi-ready;
Back side: Fine Ground or polished.
Dislocation Density
≤ 5 x 10 6cm-2
Macro Defect Density
0 cm-2
Useable Area
> 90% (edge exclusion)
Package
each in single wafer container, under nitrogen atmosphere, packed in class 100 clean room
For more information, please contact us email at victorchan@powerwaywafer.com and powerwaymaterial@gmail.com
2020-08-20meta-author
PAM-XIAMEN offers PSS patterned sapphire substrate for high brightness GaN based LED EPI growing application. The patterned sapphire substrate wafer is to grow a dry etching mask on the sapphire substrate. The mask is engraved by a standard photolithography process. Then, the sapphire is etched by ICP etching [...]
2021-04-28meta-author
We are an expert of semiconductor wafers in semiconductor industry, and we offer technology support and wafers selling for thousands of univerisities and industrial customers by our decades experience, including Cornell University, Stanford Univeristy,Peking University, Shandong Univerity, university of south carolina,Caltech Faraon lab (USA),University of California, Irvine (USA),Singapore MIT Alliance for Research and Technology Centre (SMART),West Virginia University,Purdue Univerity, University of California, Los Angeles,King Abdullah University of Science & Technology,Massachusetts Institute of Technology,University of Houston,University of Wisconsin,University of Science and Technology of China etc.
And now we show one article example as follows, who bought our wafers or service:
Article title:Structural modification and bandgap tunning of cubic AlN thin film by carbon ions irradiations
Published by:
Shakil Khan ; Ishaq Ahmad ; M. Hassan Raza ; Khizar-ul-Haq ; Ting-kai Zhao ; Fabian I. Ezema.
1.Department of Metallurgy and Materials EngineeringPakistan Institute [...]
2019-12-02meta-author
Highlights
•A recessed structure was used on the GaAs/Si solar cells to reduce the current path.
•The associated series resistance was reduced by a recessed structure.
•The carrier recombination loss was improved due to pyramid-like recessed structure.
In this study, epitaxial layers of GaAs-based solar cells were grown [...]