5-6-5 SiC MicroElectromechanical Systems (MEMS) and Sensors
As described in Hesketh’s chapter on micromachining in this book, the development and use of siliconbased MEMS continues to expand. While the previous sections of this chapter have centered on the use of SiC for traditional semiconductor electronic [...]
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5-7-2 Further Recommended Reading
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2-20.Linear Crystallographic Defects
Crystalline solids exhibit a periodic crystal structure. The positions of atoms or molecules occur on repeating fixed distances, determined by the unit cell parameters. However, the arrangement of atom or molecules in most crystalline materials is not perfect. The regular patterns are [...]
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2-3.Wafer Flat Length
Linear dimension of the at measured with ANSI certied digital calipers on a sample of one wafer per ingot.
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5-4 SiC Semiconductor Crystal Growth
As of this writing, much of the outstanding theoretical promise of SiC electronics highlighted in the
previous section has largely gone unrealized. A brief historical examination quickly shows that serious
shortcomings in SiC semiconductor material manufacturability and quality have greatly hindered the
development [...]
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2-34.Chemical Mechanical Polishing
Chemical Mechanical Polishing/Planarization is short as CMP, a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing.
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