Lapped Wafers

lapped wafers

PAM-XIAMEN offers lapped silicon carbide wafers, As-cut wafers are lapped and cleaned to be qualified as lapped wafers. What is wafer lapping? Wafer lapping is a global flattening process that improves wafer flatness by removing surface damage (usually from back grinding). It is most commonly found in silicon carbide. Lapping is carried out between two reversed rotating cast iron plates and grinding film or slurry. To adjust the permeability of the film/paste, the wafer either spins faster or undergoes a heavier load to meet the target specification. Lapping process can reduce surface roughness and mechanical defects from as-cut wafers and can further improve geometrical performance

 4″ 4H Silicon Carbide
Item No. Type Orientation Thickness Grade Micropipe Density Surface Usable area
          N-Type 
S4H-100-N-SIC-370-L 4″ 4H-N 0°/4°±0.5° 370±25um D * L/L >75%
3″ 4H Silicon Carbide
Item No. Type Orientation Thickness Grade Micropipe Density Surface Usable area
         N-Type 
S4H-76-N-SIC-370-L 3″ 4H-N 0°/4°±0.5° 370±25um D * L/L >75%
2″ 4H Silicon Carbide
Item No. Type Orientation Thickness Grade Micropipe Density Surface Usable area
N-Type 
S4H-51-N-SIC-370-L 2″ 4H-N 0°/4°±0.5° 370±25um D * L/L >75%
2″ 6H Silicon Carbide
Item No. Type Orientation Thickness Grade Micropipe Density Surface Usable area
N-Type 
S6H-51-N-SIC-370-L 2″ 6H-N 0°/4°±0.5° 370±25um D * L/L >75%
SEMI-INSULATING 
S6H-51-SI-SIC-370-L 2″ 6H-SI 0°/4°±0.5° 370±25um D * L/L >75%

 

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