A test report is necessary to show the compliance between custom description and our final wafers data. We will test the wafer characerization by equipment before shipment, testing surface roughness by atomic force microscope, type by Roman spectra instrument, resistivity by non-contact resistivity testing [...]
2018-08-14meta-author
Etching is a technique used for micromachining to chemically remove layers from the surface of a wafer during manufacturing. Etching techniques can be divided into wet etching and dry etching. PAM-XIAMEN can provide silicon etching wafer for your applications.
1. Wet Chemical Etching
The mechanism of [...]
2022-05-30meta-author
PAM-256 multi-pixel energy spectrum imaging module is composed of one or several imaging unit. The CZT imaging unit is made of 16×16 pixel detector. With back-end ASIC, it can detect energy ranges from 10KeV~700KeV, fully satisfied γ camera and SPECT.
Direct splice: The module has a [...]
2019-04-24meta-author
PAM XIAMEN offers Fe – Stainless Steel Substrate ( Polycrystaline).
Stainless Steel Substrate (SUS301 HV200-HV600 ): 1″ Dia x 0.3 mm, as cold rolling
Stainless Steel Foil: SS316 0.1mm Thick x 300mm W x 4000 mm L
Stainless Steel Foam: SS316 1mm Thick x [...]
2019-05-08meta-author
PAM-XIAMEN offers diamond on silicon wafer. Since diamond has a wide band gap, diamond thin films on silicon wafer, which is diamond epitaxial growth on silicon by MPCVD, is applied to wide band gap semiconductors, such as gas sensor devices, temperature sensor devices, radiation/infrared [...]
2019-04-19meta-author
PAM XIAMEN offers NON-LINEAR CRYSTAL CA4YO(BO3)3 YCOB.
To better serve you, we would like to discuss your specific requirement, Please Contact Us for a quote.
Product Information: Crystals can be customized
Formulation: Ca4YO(BO3)3 (YCOB)
Size: from 5 x 5 mm to 50 x 50 mm
Thickness: 50 ~ 40 mm
Optical Homogeneity: δn < 10-5 cm-1
Transparency Range: 202 ~ 25000 nm
Surface Finish: 1/8 λ
Surface [...]
2019-03-11meta-author