Testing project: TTV/WARP/BOW:

Testing project: TTV/WARP/BOW:

A wafer flatness is measured by TTV/WARP/BOW, low value shows better wafer flatness, and the epi wafer would be better quality and wafer flatness, therefore its measurement is necessary.

Test equipment:  Polarizing microscope

Test Standard:   GB/T 30867-2014;GB/T 6620-2009.

Test result:  μm(micron)

Testing project: TTV/WARP/BOW

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