PAM XIAMEN offers 2″CZ Prime Silicon Wafer
tem1, 100pcs
Silicon wafer:
i. Diameter: 50.8 mm ± 0.5 mm,
ii. Thickness: 275 μm ±25μm,
iii. Doping: P type
iv. Orientation: (100) ± 0.5°
v. TTV: ≤ 5 μm
vi. Bow and Warp: ≤ 20 μm
Growth: [...]
2020-03-25meta-author
Single-emitter LD Chip 808nm @10W
PAM200914-LD-CHIP-808nm
Brand: PAM-XIAMEN
Wavelength: 808nm
Stripe width: 190um
Output Power: 10W
Cavity Length:4mm
Operation
Symbol
Min.
Typ.
Max.
Unit
Center wavelength
λ
—
808
—
nm
Output powe
P。
—
10.5
—
w
Operation mode
—
—
CW
—
—
Geometrical
Emitter width
w
—
190
—
μm
Cavity length
L
—
4000
—
μm
Chip width
W
—
500
—
μm
Chip height
H
—
150
—
μm
Electro Optical Data
Threshold curen
Ith
—
1.6
—
A
Operating current
Iop
—
10
—
A
Operating voltage
Vop
—
1.8
—
V
Slope efficiency
ηd=PJ(lop-Ith)
—
1.2
—
WIA
Total conversion efficiency
η=Po/(lopxVop)
—
58
—
%
Slow axis divergence
θn”
—
10
—
degrees
Fast axis divergence
θ1
—
35
—
degrees
Spectral width
△λ
—
3
—
nm
Polarization
—
—
TE
—
—
For more information, please contact us email [...]
2019-05-09meta-author
PAM-XIAMEN offers CZT Preamplifier.
PAMMA-01A is a single channel CZT preamplifier. It featured low noise, high gain and charge sensitivity. Signals of semiconductor detectors and other detectors (scintillator, gas, etc.) could be readout by it. Charge sensitive pre-amplifier can be used to test the energy [...]
2020-12-10meta-author
PAM XIAMEN offers Si (Bare Prime, Thermal oxide ,Pt coated &Solar Cell Grade ).
PAM XIAMEN supplies all kinds of Silicon wafer from 1″ ~ 8″ in diameter. Particularly specializing in fabrication of Si wafer with various special size and orientation.
2″ Diameter Wafers [...]
2019-05-15meta-author
Differential magnetoresistive sensor for sale from PAM-XIAMEN is one of magnetoresistive sensors, which is packaged by indium antimonide (InSb) thin film magnetoresistor plus bias magnet with a metal shell. As a result, the output signal is a quasi-sine wave signal. The specification of differential magnetoresistive (MR) [...]
2021-08-03meta-author
Highlights
•Fabrication scheme for heterogenous Si-to-InP circuits on wafer level is described.
•Wafer-to-wafer alignment accuracy better than 4–8 μm after bonding obtained.
•Interconnects with excellent performance up to 220 GHz demonstrated.
•Palladium barrier necessary when combining Al-based technology with gold based one.
Abstract
In order to benefit from the material [...]