Silicon epitaxy with Boron dopant in size 200mm from PAM-XIAMEN is available for semiconductor device fabrication. Silicon epitaxy growth is a surface treatment process for silicon wafers, which means that a single crystal film is superimposed on the polished wafer by chemical reaction or other [...]
2021-06-08meta-author
A template-based vision system for the 100% inspection of wafer die surfaces has been developed. Design goals included a requirement for the detection of flaws as small as two thousandths of an inch on parts up to 8-in. wafer size. Each die is treated [...]
PAM XIAMEN offers single crystal LiTaO3.
LiTaO3 X-cut
LiTaO3 optical grade, X-cut, 10x10x0.5mm, 2 SP
LiTaO3 saw grade, X-cut, 10x10x0.5mm, 1sp
LiTaO3 saw grade, X-cut, 3″ Dia x 0.5mm wafer, 1sp
LiTaO3, 4″ wafer, specific parameters as follows:
4″ LT Wafer Specification
Diameter
100.0±0.5mm
Orientation Flat (OF)
30±2mm
Second Refer. Flat [...]
2019-05-08meta-author
PAM XIAMEN offers 3″ FZ Prime Silicon Wafer.
3″ Si FZ
39-47Ωcm
about 1.5mil is etched from the surfaces in order to remove any surface damage
1.5mil = 1.5*25.4= 38.1μm
For more information, please visit our website: https://www.powerwaywafer.com,
send us email at sales@powerwaywafer.com and [...]
2019-07-01meta-author
PAM XIAMEN offers Zirconium Substrate & Foil ( Polycrystalline ).
Zr – Polycrystalline Substrate: 10 x 10 x0.5 mm, One sides polished
Polycrystallline Zr substrate
Purity: 99.5%
Density: 6.52 g/cm3
Melting Point: 1855ºC
Average Grain Size: 10~50 Microns ( No annealling )
Substrate dimension: 10 x 10 x0.5 [...]
2019-05-21meta-author
PAM XIAMEN offers 6″ Monocrystalline silicon wafers with insulating oxide
6″ Monocrystalline silicon wafers with insulating oxide
Polishing: one-sided for microelectronics
Thickness: 675 +/- 20 microns
TTV <15 μm,
Warping <35 μm
P type
Orientation <100>
The thickness of the insulating oxide layer is 300 nm
Resistance of the base plate ≥ 10 [...]
2020-04-15meta-author