PAM XIAMEN offers high-quality Bi2Se3.
Molar mass: 654.8 g/mol
Appearance: Dull grey
Lattice Parameters: a=4.14 A, c=28.7 A
Density: 6.82 g/cm^3
Melting point:710 °C (1,310 °F; 983 K)
Structure: Hexagonal
Displaying products 1 – 1 of 1 results
Bi2Se3 Single crystal (0001) orn. 10x10x1.0 mm, both sides polished [...]
2019-04-17meta-author
The objective of this work is to analyze the effects of argon ion irradiation process on the structure and distribution of Te inclusions in Cd1-xZnxTe crystals. The samples were treated with different ion fluences ranging from 2 to 8 × 1017 cm−2. The state of the samples before [...]
Layer structure of 703nm Laser
We can offer Layer structure of 703nm Laser as follows:
Layer
Composition
Thickness (um)
Doping(cm-3)
Cap
P+- GaAs
0.2
Zn:>1e19
Cladding
p – Al0.8Ga0.2As
1
Zn:1e18
Etch stop
GaInP
0.008
Zn:1e18
Top barrier
Al0.45Ga0.55As
0.09
Undoped
Well
Al0.18Ga0.82As
0.004
Undoped
Barrier
Al0.45Ga0.55As
0.01
Undoped
Well
Al0.18Ga0.82As
0.004
Undoped
Barrier
Al0.45Ga0.55As
0.01
Undoped
Well
Al0.18Ga0.82As
0.004
Undoped
Bottom barrier
Al0.45Ga0.55As
0.09
Undoped
Cladding
n – Al0.8Ga0.2As
1.4
Si:1e18
Buffer
n – GaAs
0.5
Si:1e18
Substrate
n+ – GaAs
S :>1e18
Source:PAM-XIAMEN
For more information, please visit our website:https://www.powerwaywafer.com/, send us email at sales@powerwaywafer.com or powerwaymaterial@gmail.com.
Silicon carbide (SiC) single crystals are at the forefront of the silicon carbide industry chain, and are the foundation and key to the development of the high-end chip industry. The larger the SiC substrate size, the more chips can be manufactured on per unit substrate, and [...]
2023-03-31meta-author
PAM XIAMEN offers GD3GA5O12 NEODYNIUM DOPED GADOLINIUM GALLIUM GARNET CRYSTALS SUBSTRATES.
Nd:GGG (neodymium doped gadolinium gallium garnet)
Chemical formula: Nd:Gd3Ga5O12
Nd:GGG single crystal has excellent properties, such as high mechanical strength, chemical stability, thermal conductivity and thermal capacity, wide absorption bands at around 808 nm and long [...]
2019-03-12meta-author
A 3-inch GaAs epitaxial wafer can be provided for making a PIN diode chip, which can make a power electronic device with high isolation and low insertion loss. A heterojunction AlGaAs/GaAs PIN wafer makes the diode with low RF on-state resistance suitable for fabricating various [...]
2021-11-02meta-author