PAM-XIAMEN offers PBN-PG composite heater with single side and double side heating patterns.
PG ribbon thickness 0.05mm
Main Heating Zones
Front surface:
Outer element R1=13.4 Ohm (hot, at 1200-1300 deg.C), cold ~ x2 higher
Inner element R2= 8.1 Ohm (hot, at 1200-1300 deg.C), cold ~ x2 higher
Auxiliary Heating Zones
Back surface:
Outer element [...]
2019-03-13meta-author
Highlights
•Effects of atomic step width on the removal of sapphire and SiC wafers are studied.
•The reason of effects of step width on the removal and the model are discussed.
•CMP removal model of hexagonal wafer to obtain atomically smooth surface is proposed.
•The variations of atomic [...]
2015-10-28meta-author
PAM-XIAMEN can provide a series products of terahertz chip: Power Amplifier (PA) Chip, Low Noise Amplifier (LNA) Chip, PIN/FET Switch, Zero Bias Detector Chip, Amplification Frequency Multiplication Chain (AMC) Chip, MIXER Chip, Schottky Frequency Multiplication MMIC, Schottky Mixing MMIC, and Attenuator Chip. The terahertz chip is a brand-new microchip, a [...]
2021-07-16meta-author
PAM XIAMEN offers 50.8mm Si wafers.
Please send us email at sales@powerwaywafer.com if you need other specs and quantity.
Item
Material
Orient.
Diam
(mm)
Thck
(μm)
Surf.
Resistivity
Ωcm
Comment
PAM2179
p-type Si:B
[100]
2″
300
P/E
1–10
SEMI Prime, 2Flats, hard cst
PAM2180
p-type Si:Ga
[100]
2″
350
P/P
1–5
SEMI Prime, 2Flats, hard cst
PAM2181
p-type Si:B
[100]
2″
500
P/E
1–2
SEMI Prime, 2Flats, hard cst
PAM2182
p-type Si:B
[100]
2″
900
P/E/P
1–10
SEMI Prime, 2Flats, hard cst
PAM2183
p-type Si:B
[100]
2″
2000
P/P
1–10
SEMI Prime, 2Flats, Individual cst
PAM2184
p-type Si:B
[100]
2″
2000
P/E
1–10
SEMI Prime, [...]
2019-02-18meta-author
A process model of wafer thinning by diamond grinding
This paper is to develop and investigate a wafer thinning process model (WTPM) to integrate the wafer thickness into set-up parameters and predict total thickness variation (TTV) of ground wafers with modification of the wafer grinding [...]
FZ grown high-resistance silicon wafer is offered by PAM-XIAMEN for the fabrication of MEMS (Micro-electro Mechanical System). Silicon wafer is the common material for manufacturing integrated circuits in consumer electronics. Due to the availability and competitive price with high quality of silicon material, it [...]
2021-11-03meta-author