2.Definition of Dimensional Properties,Terminology and Methods of Silicon Carbide Wafer

2-31.N type

2-31.N type A semiconductor has electrical conductivity between that of a conductor and an insulator. Semiconductors differ from metals in their characteristic property of decreasing electrical resistivity with increasing temperature.Semiconductors can also display properties of passing current more easily in one direction than the other, and sensitivity to light. Because [...]

2-32.Semi-insulating

2-32.Semi-insulating Semi-insulating Doping with the impurities vanadium creates semi-insulating material of silicon carbide.

2-33.P type

2-33.P type A semiconductor has electrical conductivity between that of a conductor and an insulator. Semiconductors differ from metals in their characteristic property of decreasing electrical resistivity with increasing temperature.Semiconductors can also display properties of passing current more easily in one direction than the other, and sensitivity to light. Because [...]

2-34.Chemical Mechanical Polishing

2-34.Chemical Mechanical Polishing Chemical Mechanical Polishing/Planarization is short as CMP, a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing.

2-35.Prime Grade

2-35.Prime Grade Prime Grade:The highest grade of a silicon carbide wafer.  SEMI indicates the bulk, surface, and physical properties required to label silicon carbide wafers as “Prime Wafers”.

2-36.Reclaim Grade

2-36.Reclaim Grade Reclaim Grade:A lower quality wafer that has been used in manufacturing and then reclaimed , etched or polished, and then used a second time in manufacturing.

2-37.Test Grade

2-37.Test Grade Test Grade: A silicon carbide wafer of lower quality than Prime, and used primarily for testing processes.  SEMI indicates the bulk, surface, and physical properties required to label silicon carbide wafers as “Test Wafers”.