Single Crystal
| CeO2 Crystal | Fe3O4 Crystal | SnO2 Crystal | Cu2O Crystal |
| Fe2O3 Crystal | MnO Crystal | PrScO3 Crystal Substrate | NdScO3 Crystal Substrate |
| NdScO3 Crystal Substrate | GdScO3 Crystal Substrate | DyScO3 Crystal Substrate | SOI Wafer |
| Ti Terminal SrTiO3 | HOPG（highly oriented pyrolytic graphite） | ZnO/cAl2O3 Film | AIN on Sapphire Wafer |
The wafer of graphene for sale from PAM-XIAMEN are Monolayer Graphene on PET film, Monolayer Graphene on SiO2/Silicon, Bilayer Graphene on SiO2/Silicon, Monolayer Graphene on Copper, and graphene wafer growth on nickel for researches and industry. Graphene is a new semiconductor material with a single-layer two-dimensional honeycomb lattice structure piled up by carbon [...]
PAM-XIAMEN offers Indium Semiconductor Wafer: GaSb,GaAs, GaP GaSb Wafer Substrate – Gallium Antimonide Quantity Material Orientation. Diameter Thickness Polish Resistivity Type Dopant Nc Mobility EPD PCS (mm) (μm) Ω·cm a/cm3 cm2/Vs /cm2 1-100 GaSb (100)±0.5 50.8 500±25 SSP N/A Te 1E17 – 5E18 N/A < 1000 1-100 GaSb (111)A±0.5 50.8 500±25 SSP N/A Te 1E17 – 5E18 N/A < 1000 1-100 GaSb (111)B 50.8 N/A N/A N/A Te (5-8)E17 N/A N/A 1-100 GaSb (111)B 50.8 N/A N/A N/A Undoped none N/A N/A 1-100 GaSb (100)±0.5 50.8 500 SSP N/A P/ (1-5)E17cm-3 N/A N/A 1-100 GaSb (100)±0.5 50.8 500 SSP N/A N/ (1-5)E17cm-3 N/A N/A 1-100 GaSb (100)±0.5 50.8 500 SSP N/A N/Te (1-8)E17/(2-7)E16 N/A < 1000 1-100 GaSb (100) 50.8 450±25 SSP N/A N/A (1-1.2)E17 N/A N/A 1-100 GaSb (100) 50.8 350±25 SSP N/A N/A N/A N/A N/A 1-100 GaSb (100) 76.8 500-600 N/A N/A Undoped none N/A N/A 1-100 GaSb (100) 100 800±25 DSP N/A P/Zn N/A N/A N/A 1-100 GaSb (100) 100 250±25 N/A N/A P/ZnO N/A N/A N/A As a GaSb wafer supplier,we offer GaSb semiconductor list for your reference, if you need price detail, please contact our sales team 1)2″,3″GaSb wafer Orientation:(100)±0.5° Thickness(μm):500±25;600±25 Type/Dopant:P/undoped;P/Si;P/Zn Nc(cm-3):(1~2)E17 Mobility（cm2/V ·s):600~700 Growth [...]
Silicon Wafer Si wafer Substrate -Silicon Quantity Material Orientation. Diameter Thickness Polish Resistivity Type Dopant Nc Mobility EPD PCS (mm) (μm) Ω·cm a/cm3 cm2/Vs /cm2 1-100 Si N/A 25.4 280 SSP 1-100 P/b N/A N/A N/A 1-100 Si N/A 25.4 280 SSP 1-100 P/b (1-200)E16 N/A N/A 1-100 Si (100) 25.4 525 N/A <0.005 N/A N/A N/A N/A 1-100 Si (100) 25.4 525±25 SSP <0.005 N/A N/A N/A N/A 1-100 Si with Oxide layer (100) 25.4 525±25 SSP <0.005 N/A N/A N/A N/A 1-100 Si (100) 25.4 350-500 SSP 1~10 N/A N/A N/A N/A 1-100 Si (100) 25.4 400±25 P/E <0.05 P/ N/A N/A N/A 1-100 Si (100) 50.4 400±25 P/E <0.05 P/ N/A N/A N/A 1-100 p-Si with 90 nm SiO2 (100) 50.4 500±25 P/E <0.05 P/ N/A N/A N/A 1-100 n-Si with 90 nm SiO2 (100) 50.4 500±25 P/E <0.05 N/ N/A N/A N/A 1-100 p-Si with 285 nm SiO2 (100) 50.4 500±25 P/E <0.05 N/ N/A N/A N/A 1-100 n-Si with 285 nm SiO2 (100) 50.4 500±25 P/E <0.05 N/ N/A N/A N/A 1-100 Si with electrodes (100) 50.8 400 N/A <0.05 N/p 1E14-1E15 N/A N/A 1-100 Si (100) 50.8 275 SSP 1~10 N/A N/A N/A N/A 1-100 Si (100) 50.8 275±25 SSP 1~10 N/p N/A N/A N/A 1-100 Si (111) 50.8 350±15 SSP >10000 N/A N/A N/A N/A 1-100 Si (100) 50.8 430±15 SSP 5000-8000 N/A N/A N/A N/A 1-100 Si (111) 50.8 410±15 SSP 1~20 N/A N/A N/A N/A 1-100 Si (111) 50.8 400-500 SSP >5000 N/A N/A N/A N/A 1-100 Si (100) 50.8 525±25 SSP 1~50 N/A N/A N/A N/A 1-100 Si (100) 50.8 500±25 SSP 1~10 N P N/A N/A N/A 1-100 Si (100) 50.8 500±25 P/P >700 P/ N/A N/A N/A 1-100 Si (100) 76.2 400±25 P/E <0.05 P/ N/A N/A N/A 1-100 p-Si with 90 nm SiO2 (100) 76.2 500±25 P/E <0.05 P/ N/A N/A N/A 1-100 n-Si with 90 nm SiO2 (100) 76.2 500±25 P/E <0.05 N/ N/A N/A N/A 1-100 p-Si with 285 nm SiO2 (100) 76.2 500±25 P/E <0.05 N/ N/A N/A N/A 1-100 n-Si with 285 nm SiO2 (100) 76.2 500±25 P/E <0.05 N/ N/A N/A N/A 1-100 Si (100) 100 625 SSP >10000 N/A N/A N/A N/A 1-100 Si (100) 100 525 SSP N/A N/P N/A N/A N/A 1-100 Si (100) 100 320 SSP >2500ohm·cm P/b N/A N/A N/A 1-100 Si (100) 100 N/A SSP 10~30 N/p N/A N/A N/A 1-100 Si (100) 100 505±25 SSP 0.005-0.20 N/P-doped N/A N/A N/A 1-100 Si (100) 100 381 SSP 0.005-0.20 N/P-doped N/A N/A N/A 1-100 Si (100) 100 525 DSP 1-100 N/A N/A N/A N/A 1-100 Si (100) 100 525 DSP 1-100 N/A N/A N/A N/A 1-100 Si (100) 100 625±25 SSP 0.001-0.004 N/A N/A N/A N/A 1-100 Si [...]
E-beam and thermal evaporation of metal coatings (Ti, Cr, Au, Pt, Pd, Al, Cu, Ag etc) on silicon wafers are available from PAM-XIAMEN. Pt, Ru, Pd, Au, Ag, Co, Ti, Cu, Al, Ta, and Ni with thickness ranging from 10nm to 2.2um Metal Sputtering includes single [...]
Silicon Nitride Wafer Si3N4 Thin Film By LPCVD In Stock, But Not Limited To The Following. Wafer No. Wafer Size Polished-Side Type/Orientation Si3N4 Thickness Wafer Thickness(um) Resistivity(Ohm.Cm) Quantity(Pcs) PAM-XIAMEN-WAFER-#N1 2″ DSP, both Si3N4 N100 200nm 400±15 3-6 25 PAM-XIAMEN-WAFER-#N2 2″ SSP,both Si3N4 P100 200nm 400±15 <0.0015 24 PAM-XIAMEN-WAFER-#N3 2″ Si3N4 with Cu 48.8*3mm — — — 1 PAM-XIAMEN-WAFER-#N4 3″ DSP, both Si3N4 — 150nm — — 2 PAM-XIAMEN-WAFER-#N5 4″ SSP,both Si3N4 N100 40nm 500±10 <0.02 2 PAM-XIAMEN-WAFER-#N6 4″ DSP, both Si3N4 N100 50nm 510-540 2-4 9 PAM-XIAMEN-WAFER-#N7 4″ DSP, both Si3N4 P type 50nm 200±10 <0.02 5 PAM-XIAMEN-WAFER-#N8 4″ SSP,both Si3N4 N100 95nm 525±15 1-10 22 PAM-XIAMEN-WAFER-#N9 4″ SSP,both Si3N4 N100 100nm 500±10 <0.05 7 PAM-XIAMEN-WAFER-#N10 4″ DSP, both Si3N4 P100 200±20nm 300±10 5-10 50 PAM-XIAMEN-WAFER-#N11 4″ DSP, both Si3N4 N100 100nm 200±15 1-15 19 PAM-XIAMEN-WAFER-#N12 4″ DSP, both Si3N4 P100 150nm 500±25 10-20 1 PAM-XIAMEN-WAFER-#N13 4″ SSP,both Si3N4 P100 200nm 525±25 10-20 25 PAM-XIAMEN-WAFER-#N14 4″ SSP,both Si3N4 P type 200nm 500±10 <0.05 15 PAM-XIAMEN-WAFER-#N15 4″ DSP, both [...]
Lithium Niobate(LNOI) with Metal Electrode There are metal electrode layers (Au, Pt, Al or other metals) between the SiO2 layer and the LN film. An electric field can be applied on the LN film between the metal electrode layer and the top electrode layer. Based on piezoelectric [...]
