3-2. Scratches
3-2. Scratches
Grooves or cuts below the surface plane of the wafer having a length-to-width ratio of greater than 5 to 1. Scratches are speci ed by the number of discrete scratches times the total length in fractional diameter.
Related Posts
2-17.Polytypes
2-17.Polytypes Many compound materials exhibit polymorphism, that is they can exist in different structures called polymorphs. Silicon carbide (SiC) is unique...
2018-06-28
5-1 Introduction
5-1 Introduction Silicon carbide (SiC)-based semiconductor electronic devices and circuits are presently being developed for use in high-temperature, high-power, and high-radiation conditions...
2018-06-28
5-2-1-2 Electrical Properties
5-2-1-2 Electrical Properties Owing to the differing arrangement of Si and C atoms within the SiC crystal lattice, each SiC polytype exhibits...
2018-06-28
2-26.TTV
Total Thickness Variation (TTV): The maximum variation in the wafer thickness. Total Thickness Variation is generally determined by measuring the...
2018-06-28
5-6-4-2 SiC High-Power Switching Transistors
5-6-4-2 SiC High-Power Switching Transistors Three terminal power switches that use small drive signals to control large voltages and currents (i.e.,...
2018-06-28
2-1.Wafer Diameter
2-1.Wafer Diameter The linear distance across the surface of a circular slice which contains the slice center and excludes any flats...
2018-06-28