3-6. Edge Chips
Areas where material has been unintentionally removed from the wafer.Do not confuse fractures in epi crown with edge chips.
Related Posts
5-5-4 Patterned Etching of SiC for Device Fabrication
5-5-4 Patterned Etching of SiC for Device Fabrication At room temperature, there are no known conventional wet chemicals that etch single-crystal SiC. Most patterned etching of SiC for electronic devices and circuits is accomplished using dry etching techniques. The reader should consult References 122–124 which contain summaries [...]
2018-06-28meta-author
5-6-5 SiC MicroElectromechanical Systems (MEMS) and Sensors
5-6-5 SiC MicroElectromechanical Systems (MEMS) and Sensors As described in Hesketh’s chapter on micromachining in this book, the development and use of siliconbased MEMS continues to expand. While the previous sections of this chapter have centered on the use of SiC for traditional semiconductor electronic [...]
2018-06-28meta-author
5-2-1-2 Electrical Properties
5-2-1-2 Electrical Properties Owing to the differing arrangement of Si and C atoms within the SiC crystal lattice, each SiC polytype exhibits unique fundamental electrical and optical properties. Some of the more important semiconductor electrical properties of the 3C, 4H, and 6H SiC polytypes are given in [...]
2018-06-28meta-author
2-21.Usable Area
2-21.Usable Area A cumulative subtraction of all noted defect areas from the frontside wafer quality area within the edge exclusion zone. The remaining percent value indicates the proportion of the frontside surface to be free of all noted defects (does not include edge exclusion).
2018-06-28meta-author
2-5.Misorientation
2-5.Misorientation In wafers cut intentionally “off orientation”, the angle between the projection of the normal vector to the wafers surface onto a {0001} plane and the projection on that plane of the nearest <11-20> direction.
2018-06-28meta-author
2-37.Test Grade
2-37.Test Grade Test Grade: A silicon carbide wafer of lower quality than Prime, and used primarily for testing processes. SEMI indicates the bulk, surface, and physical properties required to label silicon carbide wafers as “Test Wafers”.
2018-06-28meta-author