PAM-XIAMEN can offer metallized diamond heat sink for solving the poor bonding force between diamond and the matrix and the early falls of the diamond due to high interface energy with most metals, ceramics, etc. A metallized diamond heat sink compound refers to plating metal on [...]
2021-06-11meta-author
PAM XIAMEN offers GaN SBD.
Parmeters
Specification
BV
300~650
If
1~20
Operation temp.
-55~150
Trr
<10
Package type
TO220-2L
TO220-3L
For more information, please visit our website: https://www.powerwaywafer.com,
send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com
Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China. PAM-XIAMEN develops advanced crystal [...]
2019-05-17meta-author
PAM XIAMEN offers 4″ Prime EPI Wafer.
Substrate:
1. Growth Method CZ
2. Diameter100+/-0.5mm
3. Type-Dopant, P- Boron
4. Resistivity 0.002 – 0.003 ohm-cm
5. Resistivity Radial Variation<10 %
6. Crystal Orientation<111> 4+/- 0.5degree
7. Primary Flat: Orientation Semi degree, Length Semi mm
8. [...]
2019-07-03meta-author
Inserting a low-temperature n-GaN underlying layer to separate nonradiative recombination centers improves the luminescence efficiency of blue InGaN/GaN LEDs
We have investigated the effects of nonradiative recombination centers (NRCs) on the device performance of InGaN/GaN multi-quantum-well (MQW) light-emitting diodes (LEDs) inserting low-temperature n-GaN (LT-GaN) underlying [...]
PAM XIAMEN offers 4″ Diameter Wafer.
4″ Diameter Wafer
Ge N-type 4” ,undoped
Ge Wafer (111) 4″ dia x 0.5 mm, 1SP, N type ( un- doped)
Ge Wafer (100) . Undoped, 4″ dia x 0.5 mm, 1SP
Ge Wafer (100) . Undoped, 4″ [...]
2019-04-25meta-author
Aluminium gallium arsenide epi wafer (AlGaAs or AlxGa1−xAs) is a semiconductor wafer material with very nearly the same lattice constant as GaAs, but a larger bandgap. The x in the formula stands a number between 0 and 1 – this indicates an arbitrary alloy [...]
2020-07-17meta-author