E-beam and thermal evaporation of metal coatings (Ti, Cr, Au, Pt, Pd, Al, Cu, Ag etc) on silicon wafers are available from PAM-XIAMEN.
Pt, Ru, Pd, Au, Ag, Co, Ti, Cu, Al, Ta, and Ni with thickness ranging from 10nm to 2.2um
Metal Sputtering includes single layer and/or the combination of the following elements: Ta, TaN, Cu, Ti, TiN, Al, Al-Si-Cu, Al-Cu, Al-Si, TiW, W, WN, WSi, and Cr.
Copper plating is available for silicon wafers with thickness between 0.2um and 30um.
Gold coated silicon wafer is in stock, but not limited to the following:
Wafer No. | Size | Material | Type | Thickness(um) | Coating Thickness | Resis.(ohm.cm) | Quantity(Pcs) |
PAM-XIAMEN-WAFER-#M2 | 4″Sputtering Au | Au coated | N100 | 435-465 | 20nmTi+100nmAu | 0.012-0.018 | 12 |
PAM-XIAMEN-WAFER-#M3 | 2″Sputtering Au | — | P100 | 430±10 | 20nmTi+100nmAu | <0.005 | 2 |
PAM-XIAMEN-WAFER-#M4 | 2″Sputtering Au | — | N100 | 430±10 | 20nmTi+1200nmAu | <0.05 | 20 |
PAM-XIAMEN-WAFER-#M5 | 2″Sputtering Au GaAs | — | Semi insulation 100 | 200um | 20nmTi+50-100nmAu | — | 4 |
PAM-XIAMEN-WAFER-#M6 | 6″Sputtering Cu | — | P100 | 675um | 200nmCu | — | 1 |
PAM-XIAMEN-WAFER-#M7 | 6″Sputtering Cu | — | N100 | 675um | 2um(2000nm)Cu | — | 13 |
PAM-XIAMEN-WAFER-#M8 | 8″Sputtering Al | — | — | 700um SSP | 500nmAl | — | 138 |
PAM-XIAMEN-WAFER-#M9 | — | — | — | — | — | — | 25 |
PAM-XIAMEN-WAFER-#M10 | 12Sputtering Cu | — | P100 | 700um DSP, sputtering in one side | 1umCu | — | 10 |
PAM-XIAMEN-WAFER-#M11 | 12Sputtering Cu | — | P100 | 700um DSP, sputtering in one side | 0.5umCu=500nmCu | — | 2 |
PAM-XIAMEN-WAFER-#M12 | 6″Sputtering Cu | — | N100 | 625±25 | 125nmCu | 0.01-0.02 | 17 |
PAM-XIAMEN-WAFER-#M13 | 2″Sputtering Au | — | P100 | 400±15 | 10nmCr+100nmAu | <0.0015 | 75 |
PAM-XIAMEN-WAFER-#M14 | 2″Sputtering Au | — | N100 | 280±15 | 10nmCr+100nmAu | <0.05 | 47 |
PAM-XIAMEN-WAFER-#M15 | 4″Sputtering Pt | — | N100 | 450um | 500nmSiO2+30nmTi+150nmPt | 0.02-0.025 | 6 |
PAM-XIAMEN-WAFER-#M16 | 2″Sputtering Au GaAs | — | N100 | 110um DSP | 100nmAu | — | 4 |
PAM-XIAMEN-WAFER-#M17 | 4″Sputtering Pt | — | P100 | 500±20 | 500nmSiO2+30nmTi+150nmPt | 1-10 | 3 |
PAM-XIAMEN-WAFER-#M18 | 4″Sputtering Pt | — | P100 | 500±10 | 500nmSiO2+30nmTi+150nmPt | <0.0015 | 15 |
PAM-XIAMEN-WAFER-#M19 | 2″Sputtering Pt | — | P100 | 430±15 | No oxide layer+30nmTi+150nmPt | — | 4 |
PAM-XIAMEN-WAFER-#C20 | 4″Silicon Wafer with sputtering Pt | — | — | — | 150nmPt | 40 | |
PAM-XIAMEN-WAFER-#C21 | 4″Silicon Wafer with sputtering Au | SSP | N100 | 450±15 | 100nmAu | 0.015-0.018 | 10 |
PAM-XIAMEN-WAFER-#C22 | 6″Silicon Wafer with Sputtering Ni | SSP | — | 650 | 200nmNi | — | 9 |
PAM-XIAMEN-WAFER-#C23 | 4″Silicon Wafer with sputtering Pt | SSP | P100 | 500±20 | 150nmPt | 1-10 | 100 |
PAM-XIAMEN-WAFER-#C24 | 4″Silicon Wafer with sputtering Pt | SSP | N100 | 500±10 | 300nmPt | <0.05 | 100 |
PAM-XIAMEN-WAFER-#C25 | 4″Silicon Wafer with sputtering Pt | — | P111 | — | 500nmSiO2+10nmTi+300nmPt | — | 100 |
PAM-XIAMEN-WAFER-#C26 | 4″Silicon Wafer with sputtering Pt | — | P100 | — | 500nmSiO2+40nmTi+300nmPt | — | 100 |
PAM-XIAMEN-WAFER-#C27 | 4″Silicon Wafer with sputtering Pt | — | P100 | — | 500nmSiO2+40nmTi+300nmPt | — | 100 |
PAM-XIAMEN-WAFER-#C28 | 4″Quartz Glass with sputtering Au | — | — | — | 20nmTi+50nmAu | — | 100 |
PAM-XIAMEN-WAFER-#C29 | 6″Silicon Wafer with Sputtering Ni | — | P100 | — | 200nmNi | — | 100 |
PAM-XIAMEN-WAFER-#C30 | 6″Silicon Wafer with Sputtering Cu | — | N100 | 625±25 | 125nmCu | — | 100 |
PAM-XIAMEN-WAFER-#C31 | 4″Silicon Wafer with sputtering Au | SSP | N100 | 475-575um | 20nmTi+100nmAu | — | 100 |
PAM-XIAMEN-WAFER-#C32 | 4″Silicon Wafer with sputtering Au | SSP | N100 | 435-465 | 20nmTi+100nmAu | 0.012-0.018 | 100 |
PAM-XIAMEN-WAFER-#C33 | 4″Silicon Wafer with sputtering Pt | SSP | P100 | 500±50 | 150nm | <0.05 | 100 |
The gold, copper, silver, platinum and other metal coated silicon wafers can be used in the nanno fields, including Ohmic contact, conductive substrates, sol-gel substrates, growing nanomaterials, etc. In addition, the metallized silicon wafer can be applied to scanning electron microscope (SEM), atomic force microscope (AFM) and other scanning probe microscope ranging, as well as cell culture, protein DNA microarray and reflectometer.
For more information, please contact us email at victorchan@powerwaywafer.com and powerwaymaterial@gmail.com.