Gold Coated Silicon Wafers

Gold Coated Silicon Wafers

E-beam and thermal evaporation of metal coatings (Ti, Cr, Au, Pt, Pd, Al, Cu, Ag etc) on silicon wafers are available from PAM-XIAMEN.

Pt, Ru, Pd, Au, Ag, Co, Ti, Cu, Al, Ta, and Ni with thickness ranging from 10nm to 2.2um

Metal Sputtering includes single layer and/or the combination of the following elements: Ta, TaN, Cu, Ti, TiN, Al, Al-Si-Cu, Al-Cu, Al-Si, TiW, W, WN, WSi, and Cr.

Copper plating is available for silicon wafers with thickness between 0.2um and 30um.

Gold coated silicon wafer is in stock, but not limited to the following:

Wafer No. Size Material Type Thickness(um) Coating Thickness Resis.(ohm.cm) Quantity(Pcs)
PAM-XIAMEN-WAFER-#M2 4″Sputtering Au Au coated N100 435-465 20nmTi+100nmAu 0.012-0.018 12
PAM-XIAMEN-WAFER-#M3 2″Sputtering Au P100 430±10 20nmTi+100nmAu <0.005 2
PAM-XIAMEN-WAFER-#M4 2″Sputtering Au N100 430±10 20nmTi+1200nmAu <0.05 20
PAM-XIAMEN-WAFER-#M5 2″Sputtering Au GaAs Semi insulation 100 200um 20nmTi+50-100nmAu 4
PAM-XIAMEN-WAFER-#M6 6″Sputtering Cu P100 675um 200nmCu 1
PAM-XIAMEN-WAFER-#M7 6″Sputtering Cu N100 675um 2um(2000nm)Cu 13
PAM-XIAMEN-WAFER-#M8 8″Sputtering Al 700um SSP 500nmAl 138
PAM-XIAMEN-WAFER-#M9 25
PAM-XIAMEN-WAFER-#M10 12Sputtering Cu P100 700um DSP, sputtering in one side 1umCu 10
PAM-XIAMEN-WAFER-#M11 12Sputtering Cu P100 700um DSP, sputtering in one side 0.5umCu=500nmCu 2
PAM-XIAMEN-WAFER-#M12 6″Sputtering Cu N100 625±25 125nmCu 0.01-0.02 17
PAM-XIAMEN-WAFER-#M13 2″Sputtering Au P100 400±15 10nmCr+100nmAu <0.0015 75
PAM-XIAMEN-WAFER-#M14 2″Sputtering Au N100 280±15 10nmCr+100nmAu <0.05 47
PAM-XIAMEN-WAFER-#M15 4″Sputtering Pt N100 450um 500nmSiO2+30nmTi+150nmPt 0.02-0.025 6
PAM-XIAMEN-WAFER-#M16 2″Sputtering Au GaAs N100 110um DSP 100nmAu 4
PAM-XIAMEN-WAFER-#M17 4″Sputtering Pt P100 500±20 500nmSiO2+30nmTi+150nmPt 1-10 3
PAM-XIAMEN-WAFER-#M18 4″Sputtering Pt P100 500±10 500nmSiO2+30nmTi+150nmPt <0.0015 15
PAM-XIAMEN-WAFER-#M19 2″Sputtering Pt P100 430±15 No oxide layer+30nmTi+150nmPt 4
PAM-XIAMEN-WAFER-#C20 4″Silicon Wafer  with sputtering Pt 150nmPt   40
PAM-XIAMEN-WAFER-#C21 4″Silicon Wafer  with sputtering Au SSP N100 450±15 100nmAu 0.015-0.018 10
PAM-XIAMEN-WAFER-#C22 6″Silicon Wafer  with Sputtering  Ni SSP 650 200nmNi 9
PAM-XIAMEN-WAFER-#C23 4″Silicon Wafer  with sputtering Pt SSP P100 500±20 150nmPt 1-10 100
PAM-XIAMEN-WAFER-#C24 4″Silicon Wafer  with sputtering Pt SSP N100 500±10 300nmPt <0.05 100
PAM-XIAMEN-WAFER-#C25 4″Silicon Wafer  with sputtering Pt P111 500nmSiO2+10nmTi+300nmPt 100
PAM-XIAMEN-WAFER-#C26 4″Silicon Wafer  with sputtering Pt P100 500nmSiO2+40nmTi+300nmPt 100
PAM-XIAMEN-WAFER-#C27 4″Silicon Wafer  with sputtering Pt P100 500nmSiO2+40nmTi+300nmPt 100
PAM-XIAMEN-WAFER-#C28 4″Quartz Glass with sputtering Au 20nmTi+50nmAu 100
PAM-XIAMEN-WAFER-#C29 6″Silicon Wafer  with Sputtering  Ni P100 200nmNi 100
PAM-XIAMEN-WAFER-#C30 6″Silicon Wafer  with Sputtering Cu N100 625±25 125nmCu 100
PAM-XIAMEN-WAFER-#C31 4″Silicon Wafer  with sputtering Au SSP N100 475-575um 20nmTi+100nmAu 100
PAM-XIAMEN-WAFER-#C32 4″Silicon Wafer  with sputtering Au SSP N100 435-465 20nmTi+100nmAu 0.012-0.018 100
PAM-XIAMEN-WAFER-#C33 4″Silicon Wafer  with sputtering Pt SSP P100 500±50 150nm <0.05 100

 

The gold, copper, silver, platinum and other metal coated silicon wafers can be used in the nanno fields, including Ohmic contact, conductive substrates, sol-gel substrates, growing nanomaterials, etc. In addition, the metallized silicon wafer can be applied to scanning electron microscope (SEM), atomic force microscope (AFM) and other scanning probe microscope ranging, as well as cell culture, protein DNA microarray and reflectometer.

For more information, please contact us email at [email protected] and [email protected].

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